Manufacturing Bits: Nov. 10

By Mark LaPedus - 10 Nov, 2015 - Comments: 1

Etching superconducting materials Superconductors are devices that have zero electrical resistance, making them attractive for a range of applications. But superconductors must be cooled down to temperatures at or near absolute zero on the Kelvin scale to work. This, in turn, limits their applications. Absolute zero equates to −273.15° on the Celsius scale and −459.67° on the Fahrenheit ... » read more

Manufacturing Bits: Oct. 27

By Mark LaPedus - 27 Oct, 2015 - Comments: 0

CD-SAXS makes progress For years, chipmakers have used metrology tools based on various optical techniques, such as scatterometry. But optical-based scatterometry may one day run out of steam, prompting the need for a possible replacement. One long-awaited candidate is called X-ray scattering. There are various flavors of X-ray scattering, including CD small-angle X-ray scattering (CD-SAXS)... » read more

Power/Performance Bits: April 28

By Jesse Allen - 28 Apr, 2015 - Comments: 0

Printing graphene aerogels Lawrence Livermore National Laboratory researchers have made graphene aerogel microlattices with an engineered architecture via a 3D printing technique known as direct ink writing, potentially leading to better energy storage, sensors, and nanoelectronics. Aerogel is a synthetic porous, ultralight material derived from a gel, in which the liquid component of the... » read more

Power/Performance Bits: March 3

By Jesse Allen - 03 Mar, 2015 - Comments: 0

Black phosphorus photodetectors Phosphorus, a highly reactive element commonly found in match heads, tracer bullets, and fertilizers, can be turned into a stable crystalline form known as black phosphorus. In a new study, researchers from the University of Minnesota used an ultrathin black phosphorus film 20 atoms thick to demonstrate high-speed data communication on nanoscale optical circui... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: University of California

Manufacturing Bits: Nov. 10

Manufacturing Bits: Oct. 27

Power/Performance Bits: April 28

Power/Performance Bits: March 3