Manufacturing Bits: Sept. 6


DARPA ALD The University of Colorado at Boulder has developed an atomic layer deposition (ALD) technology that can be performed at room temperatures. The technology, dubbed electron-enhanced ALD (EE-ALD), has been developed as part of the Local Control of Materials Synthesis (LoCo) program at the U.S. Defense Advanced Research Projects Agency (DARPA). The LoCo program is developing tech... » read more

Manufacturing Bits: Feb. 23


EUV resist venture JSR and Imec have signed a deal to form a joint venture to develop resists for extreme ultraviolet (EUV) lithography. The new company, dubbed EUV Resist Manufacturing & Qualification Center NV, is incorporated with a majority of the total shares held by JSR Micro NV. As EUV technology advances, the IC industry is putting pressure on materials suppliers and other vendo... » read more

System Bits: Dec. 29


Optoelectronics built using existing manufacturing Using only processes found in existing microchip fabrication facilities, researchers at MIT, the University of California at Berkeley, and the University of Colorado have produced a working optoelectronic microprocessor that computes electronically but uses light to move information. The researchers reminded that optical communications prom... » read more

Manufacturing Bits: Oct. 29


Diamond chips The optical transistor, which transports photons, holds great promise. Photons are not only faster than electrons, but they have less crosstalk. But optical transistors are also expensive and difficult to produce. In a possible breakthrough, the ICFO-Institute of Photonic Sciences has demonstrated a “nano-size” diamond that can act as an efficient optical switch. Researche... » read more

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