Manufacturing Bits: Aug. 31

By Mark LaPedus - 31 Aug, 2021 - Comments: 0

X-ray nanotomography The U.S. Department of Energy’s (DOE) Argonne National Laboratory has developed a new method for improving the resolution of hard X-ray nanotomography. In general, tomography involves a system, which takes images or cross sections of a sample using X-rays or ultrasound. The images are then re-created in the form of a 3D model. One common form is called micro-comput... » read more

Manufacturing Bits: Oct. 16

By Mark LaPedus - 16 Oct, 2018 - Comments: 0

World’s fastest camera The Institut national de la recherche scientifique (INRS) in Canada has developed what researchers say is the world’s fastest camera. The camera, called T-CUP, is capable of capturing ten trillion frames per second. It’s possible to nearly freeze time to see various phenomena in the system. In a system, the technology can be used to take high-speed images of sam... » read more

Manufacturing Bits: June 5

By Mark LaPedus - 05 Jun, 2018 - Comments: 0

Water insulators North Carolina State University, the Oak Ridge National Laboratory (ORNL) and Texas A&M University have developed what could be considered as water insulators for energy storage applications. Basically, researchers sandwiched water between two materials, enabling higher power storage devices with more efficiency. More specifically, in the lab, researchers developed a compou... » read more

Manufacturing Bits: June 6

By Mark LaPedus - 06 Jun, 2017 - Comments: 0

Molecular black holes A group of researchers have used an ultra-bright pulse of X-ray light to hit a tiny atom in a molecule, causing the structure to explode and create a “molecular black hole.” The molecular black hole is different than a black hole in space, however. A black hole is a region in space, which has a gravitational field so strong that no matter or light can escape it. ... » read more

Manufacturing Bits: Feb. 16

By Mark LaPedus - 16 Feb, 2016 - Comments: 0

Monoxide chips Two-dimensional (2D) materials are gaining steam in the R&D labs. The 2D materials could enable a new class of field-effect transistors (FETs), but the technology isn’t expected to appear until sometime in the next decade. The 2D materials include graphene, boron nitride and the transition-metal dichalcogenides (TMDs). One TMD, molybdenum diselenide (MoS2), is gaining inter... » read more

Manufacturing Bits: Oct. 13

By Mark LaPedus - 13 Oct, 2015 - Comments: 0

Exploring plasmas with lasers The Department of Energy’s SLAC National Accelerator Laboratory has upgraded its high-power laser system to 200 terawatts of power, roughly 100 times the world’s total power consumption compressed into tens of femtoseconds. The peak power before the upgrade was 30 terawatts. The upgraded laser will be coupled with SLAC's X-ray laser, dubbed the Linac Cohere... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer