tag: University of North Carolina

Chip Industry Week In Review

By The SE Staff - 23 Aug, 2024 - Comments: 0

Chinese firms imported almost $26 billion worth of chipmaking machinery, according to fresh trade data released by China’s General Administration of Customs this week, Bloomberg reports. Meanwhile, the global semiconductor manufacturing industry continued to show signs of improvement in Q2 2024 with significant growth of IC sales, stabilizing capital expenditure, and an increase in install... » read more

Chip Industry Week In Review

By The SE Staff - 22 Nov, 2023 - Comments: 0

By Jesse Allen, Susan Rambo, and Liz Allan The U.S. government will invest about $3 billion for the National Advanced Packaging Manufacturing Program (NAPMP), including an advanced packaging piloting facility to help U.S. manufacturers adopt new technology and workforce training programs. It also will provide funding for projects concentrating on materials and substrates; equipment, tools, ... » read more

AI Storm Brewing

By Ed Sperling - 23 Feb, 2017 - Comments: 0

AI is coming. Now what? The answer isn't clear, because after decades of research and development, AI is finally starting to become a force to reckon with. The proof is in the M&A activity underway right now. Big companies are willing to pay huge sums to get out in front of this shift. Here is a list of just some of the AI acquisitions announced or completed over the past few years: ... » read more

Trending Articles

Chip Industry Week In Review

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by The SE Staff

Government Chip Funding Spreads Globally

Nations vie for a piece of the semiconductor pie with offers of cash, subsidies, tax breaks, and other approaches.

Chip Industry Week In Review

Auto chiplet consortium; more nuke plants for AI; critical IC materials risk; TIMs; Foxconn in Mexico; ML in auto MCUs; 3nm PHY chiplet; chip health monitoring; AI test.

by The SE Staff

Metrology Advances Step Up To Sub-2nm Device Node Needs

Fab processes that enable stacked transistors, hybrid bonding, and advanced packaging are driving the need for more and better measurements.

by Laura Peters

Startup Funding: Q3 2024

New startups emerge from stealth; 75 companies raise $2 billion.

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Intel Vs. Samsung Vs. TSMC

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Partitioning In The Chiplet Era

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3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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The critical, and growing, significance of mature node chips and processes.

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Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Chip Industry Week In Review

Softbank's acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.

by The SE Staff

Startup Funding: Q2 2024

Big rounds for AI chips; 91 startups raise $2.6 billion.

by Jesse Allen

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