System Bits: Oct. 25

By Ann Mutschler - 25 Oct, 2016 - Comments: 0

Scalable quantum computers In what they say is a significant step towards to the realization of a scalable quantum computer, researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits. The quantum socket is a wiring method that uses 3D based on spring-lo... » read more

System Bits: Jan. 26

By Ann Mutschler - 26 Jan, 2016 - Comments: 0

Precisely controlling graphene molecules Researchers at UCLA’s California NanoSystems Institute have found that in the same way gardeners may use sheets of plastic with strategically placed holes to allow plants to grow but keep weeds from taking root, the same basic approach can be applied in terms of placing molecules in the specific patterns they need within tiny nanoelectronic devices, w... » read more

Power/Performance Bits: April 21

By Jesse Allen - 21 Apr, 2015 - Comments: 0

Harvesting more electromagnetic energy Researchers from the University of Waterloo in Canada showed for the first time that it's possible to collect essentially all of the electromagnetic energy that falls onto a surface. Their approach involves the use of metamaterials that can be tailored to produce media that neither reflects nor transmits any power, enabling full absorption of incident w... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: University of Waterloo

System Bits: Oct. 25

System Bits: Jan. 26

Power/Performance Bits: April 21