Week in Review: IoT, Security, Autos

By Jeff Dorsch And Susan Rambo - 18 Oct, 2019 - Comments: 0

Products/Services The Networking for Autonomous Vehicles Alliance announces that Marvell Semiconductor is joining the NAV Alliance following its acquisition of Aquantia. Fourteen companies are in the industry organization, including Bosch, Continental, Nvidia, and Volkswagen. “The NAV Alliance is developing the platforms that will create the future of transportation and we believe that Multi... » read more

Week in Review – IoT, Security, Autos

By Jeff Dorsch - 04 Oct, 2019 - Comments: 0

Products/Services Cadence Design Systems is working with Adesto Technologies to grow the Expanded Serial Peripheral Interface (xSPI) communication protocol ecosystem, for use in Internet of Things devices. The Cadence Memory Model for xSPI allows customers to ensure optimal use of the octal NOR flash with the host processor in an xSPI system, including support for Adesto’s EcoXiP octal xSPI ... » read more

Week in Review – IoT, Security, Autos

By Jeff Dorsch - 06 Sep, 2019 - Comments: 0

Products/Services Rambus entered an exclusive agreement to acquire the Silicon IP, Secure Protocols, and Provisioning business from Verimatrix, formerly known as Inside Secure. Financial terms were not revealed. The transaction is expected to close this year. Rambus will use the Verimatrix offerings in such demanding applications as artificial intelligence, automotive, the Internet of Things, ... » read more

Week in Review: IoT, Security, Autos

By Jeff Dorsch - 16 Aug, 2019 - Comments: 0

Products/Services Arm released a survey of 650 industry representatives about eSIM and iSIM technology. Ninety percent of the respondents were aware of eSIM, while 43% were unaware of iSIM. Vincent Korstanje, vice president and general manager, Emerging Businesses at Arm, cites the leading three obstacles to large commercial deployments: Resistance from traditional stakeholders (69% of respond... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 24 May, 2019 - Comments: 0

Internet of Things The Wing unit of Alphabet this summer will begin making drone deliveries in the Vuosarri district of Helsinki, Finland. The unmanned aerial vehicles will bear food and other items from Herkku Food, a gourmet market, and the Café Monami restaurant. The drones will bear deliveries of up to 3.3 pounds over distances of up to 6.2 miles. Comcast is reportedly developing an in... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 03 May, 2019 - Comments: 0

Internet of Things AT&T reports the activation of its narrowband Internet of Things network in the U.S. The carrier upgraded its 4G LTE cell sites across the country. It now offers two low-power wide-area networks to business customers, including its LTE-M network in Mexico and the U.S. “Both networks are designed for the IoT within licensed spectrum and provide carrier-grade security,�... » read more

FAA Traffic Management Anticipates Flying Cars

By Kevin Fogarty - 17 Oct, 2018 - Comments: 0

It may be a year or more before the U.S. Federal Aviation Administration (FAA) changes its rules enough for Amazon or other hopefuls to deliver products by drones. But the five-year FAA Reauthorization Act of 2018, signed into law Oct. 5, confirmed controversial rules the FAA considers critical to its ability to regulate drone traffic and confirmed funding and plans for drone-specific additi... » read more

Design Challenges Of Next-Generation AESA Radar

By NI - 07 Aug, 2017 - Comments: 0

Phased-array antennas, first used in military radar systems, are gaining in popularity for a variety of applications with new active electronically-scanned arrays (AESAs) being used for radar systems in satellites and unmanned aerial vehicles. As these systems are deployed, meeting size and performance requirements are critical. To support AESA radar development efforts, electronic design autom... » read more

Knowledge Centers
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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

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3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

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tag: unmanned aerial vehicles

Week in Review: IoT, Security, Autos

Week in Review – IoT, Security, Autos

Week in Review – IoT, Security, Autos

Week in Review: IoT, Security, Autos

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

FAA Traffic Management Anticipates Flying Cars

Design Challenges Of Next-Generation AESA Radar