Manufacturing Bits: Nov. 25

By Mark LaPedus - 25 Nov, 2015 - Comments: 0

Asteroid mining and metrology The U.S. House of Representatives has approved a new space bill. The bill, entitled H.R. 2262— U.S. Commercial Space Launch Competitiveness, includes a provision that discusses the rights for companies that mine any materials on asteroids. In simple terms, the bill recognizes the right of U.S. companies to own asteroid resources that they mine in space, accordin... » read more

System Bits: Sept. 29

By Ann Mutschler - 29 Sep, 2015 - Comments: 0

Light detector on a chip for portable sensors The invention by Vanderbilt University and Ohio University researchers of the first integrated circularly polarized light detector on a silicon chip could open the door for development of small, portable sensors to expand the use of polarized light in drug screening, surveillance, optical communications, quantum computing, and other applications. ... » read more

Power/Performance Bits: Oct. 29

By Ann Mutschler - 29 Oct, 2013 - Comments: 0

Supercapacitor for electricity storage With the potential for solar cells that produce electricity 24/7 and mobile phones with built-in power cells that recharge in seconds and work for weeks between charges, researchers at Vanderbilt University have created a novel supercapacitor design with these and other applications in mind. They believe it is the first supercapacitor made out of silic... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Vanderbilt University

Manufacturing Bits: Nov. 25

System Bits: Sept. 29

Power/Performance Bits: Oct. 29