tag: Verilock

Chip Industry Week In Review

By The SE Staff - 29 Sep, 2023 - Comments: 0

By Susan Rambo, Liz Allan, and Gregory Haley. TSMC rolled out the second version of its 3Dblox, which creates an infrastructure for stacking chiplets and other necessary components in a package, along with a standardized way of achieving that. Two novel features are chiplet mirroring for design reuse, and what is basically sandbox for power and thermal analysis of different design elements. ... » read more

Making PUFs Even More Secure

By Bryon Moyer - 06 Jan, 2022 - Comments: 0

As security has become a must-have in most systems, hardware roots of trust (HRoTs) have started appearing in many chips. Critical to an HRoT is the ability to authenticate and to create keys – ideally from a reliable source that is unviewable and immutable. “We see hardware roots of trust deployed in two use models — providing a foundation to securely start a system, and enabling a se... » read more

Trending Articles

Chip Industry Week In Review

Applied Materials' $4B facility at risk; AI chip bonanza; Japan, U.S. alliance; Rapidus' U.S. subsidiary; EDA revenue up; TSMC $6.6B funding; Infineon, Amkor team up; S. Korea's big bet; Apple's processor overhaul; high-NA EUVL defect system; chiplet HW security module; new Spectre attack.

by The SE Staff

Chip Industry Week In Review

China restricts U.S. processors; Samsung's CXL, DRAM module and roadmap; ASML's $2.7B retention bonus; U.S., Mexico partner up; Keysight's $1.5B offer to Spirent; Lam's new pulsed laser deposition; new OSAT center.

by The SE Staff

Architecting Chips For High-Performance Computing

Data center IC designs are evolving, based on workloads, but making the tradeoffs for those workloads is not always straightforward.

by Ann Mutschler

What Works Best For Chiplets

Not all chiplets are interchangeable, and options will be limited.

by Anne Meixner

Chip Industry Week In Review

IC sales up; Taiwan's quake; Japan's big bets; Intel Foundry loss; edgeAI startup funding; smartphone market's recovery; robots; data center security; NoCs in 3D.

by The SE Staff

Knowledge Centers
Entities, people and technologies explored

Related Articles

Money Pours Into New Fabs And Facilities

Investments boom as countries and companies vie for supply chain security and technology leadership.

by Liz Allan

The Rising Price Of Power In Chips

More data requires faster processing, which leads to a whole bunch of problems — not all of which are obvious or even solvable.

by Ed Sperling

Chiplet IP Standards Are Just The Beginning

Data and protocol interoperability standards are needed for EDA tools, and there are more hurdles ahead. Customized chiplets will be required for AI applications.

by Ann Mutschler

The Future Of Memory

From attempts to resolve thermal and power issues to the roles of CXL and UCIe, the future holds a number of opportunities for memory.

by Karen Heyman

Backside Power Delivery Gears Up For 2nm Devices

But this novel approach to optimizing logic performance depends on advancing lithography, etching, polishing, and bonding processes.

by Laura Peters

Silicon Photonics Manufacturing Ramps Up

The promise of photonics ICs is spurring innovation, but complex processes and a lack of open foundries are keeping it from reaching its full potential.

by Gregory Haley

Visa Shakeup On Tap To Help Solve Worker Shortage

Adjustments to H-1B visa program could help keep highly qualified engineers in the U.S.

by Liz Allan

X-ray Inspection In The Semiconductor Industry

Utilizing multiple technologies helps create a more complete inspection picture.

by Chris Rand

About

Navigation

Connect With Us

Facebook
Twitter @semiEngineering
LinkedIn
YouTube

Copyright ©2013-2024 SMG | Terms of Service | Privacy Policy