Startup Funding: September 2021

By Jesse Allen - 04 Oct, 2021 - Comments: 0

Startups focused on data center chips had a big month in September. A new emergent from stealth promises to accelerate big data analytics, and startups proving CXL connectivity and high-performance RISC-V chiplets also drew funding. On the other end of the spectrum, NB-IoT and edge AI designers saw investment while a company providing on-chip monitoring can predict when chips will fail. Plus, c... » read more

Startup Funding: April 2021

By Jesse Allen - 03 May, 2021 - Comments: 0

April showers brought mega fundraising rounds to the semiconductor industry. In China, a mobile chipset maker looking to go public won significant funding along with partnerships with major smartphone companies. In the US, AI hardware startups are drawing interest with unique processor architectures and business models. Plus, a major test and design services company drew new investment. This mo... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 22 Jan, 2016 - Comments: 0

Samsung Electronics announced that it has begun producing the industry’s first 4-gigabyte DRAM package based on the second-generation High Bandwidth Memory (HBM2) interface. The 4GB HBM2 package is created by stacking a buffer die at the bottom and four 8-gigabit core dies on top. These are then vertically interconnected by TSV holes and microbumps. A single 8Gb HBM2 die contains over 5,000 T... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Startup Funding: September 2021

Startup Funding: April 2021

The Week In Review: Manufacturing