3DICs: Legalizer Techniques For Better Routing Quality, Fewer DRVs, And Reduced Total Slack With Negligible Runtime Impact

A technical paper titled “On Legalization of Die Bonding Bumps and Pads for 3D ICs” was published by researchers at the Georgia Institute of Technology, NVIDIA Corporation, and the University of Bremen. Abstract "State-of-the-art 3D IC Place-and-Route flows were designed with older technology nodes and aggressive bonding pitch assumptions. As a result, these flows fail to honor the widt... » read more