Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 18 Sep, 2020 - Comments: 0

Security Synopsys’ Software Integrity Group published the results of a security survey that looked at the ways organizations across industries are handling their software security initiatives and how to improve them. The Building Security In Maturity Model (BSIMM) version 11 (BSIMM11 Study) describes the work of 8,457 software security pros. FinTech — the technology that “follows the mon... » read more

Week In Review: Design, Low Power

By Jesse Allen - 18 Sep, 2020 - Comments: 0

Nvidia will acquire Arm from SoftBank in a $40 billion deal. Nvidia says that Arm will continue to operate its open-licensing model while maintaining global customer neutrality. SoftBank acquired Arm in 2016 for $32 billion; it also holds an ownership stake in Nvidia that is expected to remain under 10%. The deal does not include Arm's IoT Services Group. The acquisition will need to pass regul... » read more

Week In Review: Design, Low Power

By Jesse Allen - 17 Jul, 2020 - Comments: 0

Siemens will acquire Avatar Integrated Systems. The company's place-and-route tools, which will become part of Mentor's Xcelerator portfolio, include a netlist-to-GDS full-function block-level physical implementation tool and a complete top-level prototyping, floor-planning and chip assembly tool. Based in Santa Clara, CA, Avatar was formed in 2017 from the acquired assets of ATopTech. ATopTech... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 17 Jul, 2020 - Comments: 0

Arm's parent company, Japanese tech conglomerate Softbank, reportedly is considering a sale or IPO of its Arm subsidiary, which it purchased in 2016 for $32 billion in cash. Considering that Arm chips are in most smart phones, as well as an increasing number of computers and IoT and edge devices, this development is being closely followed by most of the tech world. Last week, Softbank directed ... » read more

Knowledge Centers
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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: VITEC

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

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