tag: VLSI Research

Testing Analog Chips
By Jeff Dorsch - 05 Feb, 2018 - Comments: 0

The world of analog components is broad and diverse, and while testing analog chips may not take as long as running tests on complex SoCs, there are different requirements for analog devices. One type of chip that's seeing more application these days is analog microelectromechanical system devices. Automotive electronics call for a number of [getkc id="37" kc_name="analog"] chips, along with... » read more

Packaging Challenges For 2018
By Mark LaPedus - 08 Jan, 2018 - Comments: 0

The IC packaging market is projected to see steady growth this year, amid ongoing changes in the landscape. The outsourced semiconductor assembly and test ([getkc id="83" kc_name="OSAT"]) industry, which provides third-party packaging and test services, has been consolidating for some time. So while sales rising, the number of companies is falling. In late 2017, for example, [getentity id="2... » read more

Auto Chip Test Issues Grow
By Jeff Dorsch - 08 Jan, 2018 - Comments: 0

By Jeff Dorsch & Ed Sperling Semiconductor suppliers are flocking to the automotive chip market to gain share in fitting out the connected car and the autonomous vehicle. But before those chips are sold to automotive manufacturers and Tier 1 suppliers, they must be tested and certified to meet stringent industry standards. This is no ordinary testing, though. Assisted and autonomous v... » read more

Foundry Challenges in 2018
By Mark LaPedus - 27 Dec, 2017 - Comments: 6

The silicon foundry business is expected to see steady growth in 2018, but that growth will come with several challenges. On the leading edge, GlobalFoundries, Intel, Samsung and TSMC are migrating from the 16nm/14nm to the 10nm/7nm logic nodes. Intel already has encountered some difficulties, as the chip giant recently pushed out the volume ramp of its new 10nm process from the second half ... » read more

Changes Ahead For Test
By Jeff Dorsch - 11 Dec, 2017 - Comments: 0

Testing microprocessors is becoming more difficult and more time consuming as these devices are designed to take on more complex tasks, such as accelerating artificial intelligence computing, enabling automated driving, and supporting deep neural networks. This is not just limited to microprocessors, either. Graphics processing units are grabbing market share in supercomputing and other area... » read more

Memory Test Challenges, Opportunities
By Jeff Dorsch - 18 Oct, 2017 - Comments: 0

The semiconductor capital equipment market is on fire, and the memory chip test equipment sector is no different. But it is getting much more difficult on the memory side. Memory test vendors are contending with next-generation devices, such as 3D NAND flash memories, HBM2 chips, low-power double-data-rate DRAMs, graphics DRAMs, phase-change memories, magnetoresistive RAMs, and resistive RAM... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Sep, 2017 - Comments: 1

Chipmakers Toshiba is still looking for a buyer for its prized NAND flash memory business. The leading contenders for the business are a consortium with Western Digital. Meanwhile, Toshiba’s memory unit is expanding its Fab 6 facility at its Yokkaichi Operations, based in Japan. And now, it has selected a site for its next fab in Japan, this time in Kitakami City, Iwate. Construction is expe... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 23 Jun, 2017 - Comments: 0

Chipmakers The NAND market is in flux. Not long ago, troubled Toshiba put its memory unit on the block. Finally, the company has selected a group to buy its memory business. The consortium includes the Innovation Network Corp. of Japan, the Development Bank of Japan and Bain Capital. Rival SK Hynix is also part of the group. Others attempted to bid on the business, including Western Digita... » read more

New BEOL/MOL Breakthroughs?
By Mark LaPedus - 15 Jun, 2017 - Comments: 1

Chipmakers are moving ahead with transistor scaling at advanced nodes, but it's becoming more difficult. The industry is struggling to maintain the same timeline for contacts and interconnects, which represent a larger portion of the cost and unwanted resistance in chips at the most advanced nodes. A leading-edge chip consists of three parts—the transistor, contacts and interconnects. The ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 26 May, 2017 - Comments: 0

Chipmakers Samsung has formed a new foundry division and rolled out a range of new processes. Specifically, Samsung plans to develop 8nm, 7nm, 6nm, 5nm and 4nm. It also introduced an 18nm FD-SOI technology. GlobalFoundries has provided more details about its 300mm fab plans in China. The company and the Chengdu municipality have announced an investment to develop an ecosystem for its 22nm ... » read more

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