Israel: Startup Powerhouse

By Ed Sperling - 05 Oct, 2020 - Comments: 0

Israel is at the front of pack with China and the United States when it comes to tech startups. But when it comes to large, indigenous tech giants, the country is nowhere to be seen. Virtually every major semiconductor company does business in Israel, and many have a strong presence there through centers of excellence or companies they have acquired. But after decades of innovation ranging f... » read more

Alexa, Can You Help Me Build A Better SoC?

By Anush Mohandass - 03 Oct, 2016 - Comments: 0

Consumers have fallen love with clever products like Amazon Echo, Nest, Google maps, Waze and Zillow that somehow make life a little easier and more fun. The underlying technology that makes these apps so rich and useful is machine learning and it seems to be showing up everywhere. Maybe it’s time to ask, “Alexa, can you help me build a better SoC?” The Next Frontier in SoC Architectur... » read more

Following Real Money On The IoT

By Ed Sperling - 04 Sep, 2014 - Comments: 0

We probably need to change the wording, but the next killer apps for the Internet of Things likely will be ones that save lives. A common approach by vendors looking to capitalize on the IoT is simply to mash together different vertical segments and technologies that never went together in the past. A crowd-based real-time GPS/traffic system like Waze would never have existed a decade ago (... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Waze

Israel: Startup Powerhouse

Alexa, Can You Help Me Build A Better SoC?

Following Real Money On The IoT