Research Bits: Dec. 20

By Susan Rambo - 20 Dec, 2022 - Comments: 0

Patch tracks blood in deep tissue A skin-worn photoacoustic patch developed by a research team at the University of California San Diego is equipped with arrays of laser diodes and piezoelectric transducers to detect biomolecules in deep tissues, which usually would require a magnetic resonance imaging (MRI) and X-ray-computed tomography. The patch may help doctors tract hemoglobin in real tim... » read more

System Bits: Aug. 20

By Jeff Dorsch - 20 Aug, 2019 - Comments: 0

Blockchain integrated into energy systems Researchers at Canada’s University of Waterloo integrated blockchain technology into energy systems, a development that may expand charging infrastructure for electric vehicles. In a study that outlines the new blockchain-oriented charging system, the researchers found that there is a lack of trust among charging service providers, property owners... » read more

System Bits: Jan. 17

By Ann Mutschler - 17 Jan, 2017 - Comments: 0

Turning quantum systems from novelties into useful technologies In what is believed to be a major achievement that could help bring the strange and powerful world of quantum technology closer to reality, University of Sydney researchers have demonstrated the ability to “see” the future of quantum systems, and used that knowledge to preempt their demise. The applications of quantum-enabl... » read more

System Bits: Feb. 2

By Ann Mutschler - 02 Feb, 2016 - Comments: 0

Wearable sensors reveal health data from sweat In the name of science, UC Berkeley researchers want you to break out into a sweat — so it can be analyzed, of course. Specifically, the researchers have created a flexible sensor system that can measure metabolites and electrolytes in sweat, calibrate the data based upon skin temperature and sync the results in real time to a smartphone. The... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: wearable sensors

Research Bits: Dec. 20

System Bits: Aug. 20

System Bits: Jan. 17

System Bits: Feb. 2

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