System Bits: April 14

By Ann Mutschler - 14 Apr, 2015 - Comments: 0

Antennas on a chip In what is being called the missing piece of the puzzle of electromagnetic theory, a team of researchers at the University of Cambridge have figured out one of the mysteries of electromagnetism, that they believe could allow the design of antennas small enough to be integrated into a chip. These ultra-small antennas – the so-called ‘last frontier’ of semiconductor desi... » read more

Enabling Wearable Electronics In The Internet of Things (IoT) Era

By Bharat Ramakrishnan - 20 Mar, 2014 - Comments: 0

As part of its growth focus for Applied Materials, the Office of the CTO (Chief Technology Officer) aims to do the following: Identify, incubate and commercialize growth opportunities in new and adjacent markets Build a culture of open innovation at Applied Materials Address market inflections and high value problems through differentiated solutions Shape the future of our growth mark... » read more

Put On The Future: Wearable Technology

By Various Writers - 17 Jan, 2014 - Comments: 0

While jogging, your shoes can record your running speed, acceleration, path and distance. While taking a subway, the ring you wear can display how far your train is and how soon it will come; it also shows you at which stop you should take a transfer and when the next train will arrive. While putting on your mask in a city with poor air quality, your mask not only protects you, but it also dete... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: wearable technology

System Bits: April 14

Enabling Wearable Electronics In The Internet of Things (IoT) Era

Put On The Future: Wearable Technology