Big Changes In AI Design

By Ed Sperling And Susan Rambo - 06 Aug, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss AI and its move to the edge with Steven Woo, vice president of enterprise solutions technology and distinguished inventor at Rambus; Kris Ardis, executive director at Maxim Integrated; Steve Roddy, vice president of Arm's Products Learning Group; and Vinay Mehta, inference technical marketing manager at Flex Logix. What follows are excerpts of that ... » read more

Are Better Machine Training Approaches Ahead?

By Bryon Moyer - 01 Jul, 2020 - Comments: 1

We live in a time of unparalleled use of machine learning (ML), but it relies on one approach to training the models that are implemented in artificial neural networks (ANNs) — so named because they’re not neuromorphic. But other training approaches, some of which are more biomimetic than others, are being developed. The big question remains whether any of them will become commercially viab... » read more

AI Inference Memory System Tradeoffs

By Geoff Tate - 01 Aug, 2019 - Comments: 1

When companies describe their AI inference chip they typically give TOPS but don’t talk about their memory system, which is equally important. What is TOPS? It means Trillions or Tera Operations per Second. It is primarily a measure of the maximum achievable throughput but not a measure of actual throughput. Most operations are MACs (multiply/accumulates), so TOPS = (number of MAC units) x... » read more

Inferencing In Hardware

By Ed Sperling - 06 Dec, 2018 - Comments: 0

Cheng Wang, senior vice president of engineering at Flex Logix, examines shifting neural network models, how many multiply-accumulates are needed for different applications, and why programmable neural inferencing will be required for years to come. https://youtu.be/jb7qYU2nhoo See other tech talk videos here. » read more

Energy-Efficient AI

By Ed Sperling - 30 Aug, 2018 - Comments: 1

Carlos Maciàn, senior director of innovation for eSilicon EMEA, talks about how to improve the efficiency of AI operations by focusing on the individual operations, including data transport, computation and memory. https://youtu.be/A3p_w7ENefs » read more

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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Big Changes In AI Design

Are Better Machine Training Approaches Ahead?

AI Inference Memory System Tradeoffs

Inferencing In Hardware

Energy-Efficient AI

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