Week In Review: Design, Low Power

By Jesse Allen - 30 Nov, 2018 - Comments: 0

Tools & IP UltraSoC debuted functional safety-focused Lockstep Monitor, a set of configurable IP blocks that are protocol aware and can be used to cross-check outputs, bus transactions, code execution, and register states between two or more redundant systems. It supports all common lockstep / redundancy architectures, including full dual-redundant lockstep, split/lock, master/checker, and... » read more

Verification Grows Up

By Brian Bailey - 05 Jan, 2016 - Comments: 2

Semiconductor Engineering sat down with a group of verification experts to see how much progress has been made in solving issues associated with the profession. Panelists included Mike Baird, President of Willamette HDL; Jin Zhang, VP marketing and customer relations for [getentity id="22147" comment="Oski Technology"] and Lauro Rizzatti, a marketing consultant and previously the general manage... » read more

Verification Grows Up

By Brian Bailey - 22 Dec, 2015 - Comments: 0

Semiconductor Engineering sat down with a group of verification experts to see how much progress has been made in solving issues associated with the profession. Panelists included Mike Baird, president of Willamette HDL; Jin Zhang, VP marketing and customer relations for [getentity id="22147" comment="Oski Technology"], and Lauro Rizzatti, a marketing consultant and previously the general manag... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Willamette HDL

Week In Review: Design, Low Power

Verification Grows Up

Verification Grows Up