Chip Industry Week in Review
AI chip sales to China resume; TSMC accelerates U.S. production; Synopsys-Ansys done deal; Chinese espionage; Nikon's new litho system; SiC, GaN buildout; CPO market; rowhammer attack on GPUs; Q2 startup funding; Softbank's agentic AI plans; new TGV glass substrate.
Startup Funding: Q2 2025
New architectures and manufacturing methods draw investors; 75 startups raise $1.9 billion.
Data Center CPU Dominance Is Shifting To AMD And Arm
Opinion: AMD is close to surpassing Intel in x86, but Arm thinks it can take the lead over x86.
How Advanced Packaging Is Reshaping Inspection
Next-generation optical inspection is about more than just sensitivity. It’s about reliably seeing through complexity.
Chip Industry Week in Review
U.S. lifts EDA export restrictions to China; collusion risk in the IC supply chain; Onto buys materials analysis biz; Tenstorrent acquires Blue Cheetah; assembly-test report; co-packaged optics RFI; no AI without energy; Huawei's 1,900-mile EV range battery; Japan's security requirements for subsidies; quantum for EUV litho.
Advanced Packaging Fundamentals for Semiconductor Engineers
New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.
Chip Industry Week in Review
AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.
Chip Industry Week in Review
EDA export controls; Synopsys-Ansys divest requirements; SIA Factbook; McKinsey effects of tariffs; ASE's fan-out bridge; earnings; TSMC's design center; China's legacy chips play; AMD's optical acquisition.
Chip Industry Week in Review
AI chip sales to China resume; TSMC accelerates U.S. production; Synopsys-Ansys done deal; Chinese espionage; Nikon's new litho system; SiC, GaN buildout; CPO market; rowhammer attack on GPUs; Q2 startup funding; Softbank's agentic AI plans; new TGV glass substrate.
RISC-V’s Increasing Influence
Does the world need another CPU architecture when that no longer reflects the typical workload? Perhaps not, but it may need a bridge to get to where it needs to be.
Chip Industry Week in Review
IC, AI global ranking; China's fully automated IC design system; Micron goes bigger; PCIe 7.0 spec; TSMC-Tokyo joint lab; panel-level packaging win; first neuromorphic compute system; GAA forksheets; AMD's new GPUs.
Tape-Out Failures Are The Tip Of The Iceberg
As the success rate for the semiconductor industry declines, it may be time to rethink our priorities.
Power Delivery Challenges For AI Chips
Rising power densities and new architectures are forcing a rethinking of interconnects, materials, and thermal management.
