Revolutionizing High-Performance Silicon With Next-Gen Chiplets

By Shivi Arora - 31 Oct, 2024 - Comments: 0

By Shivi Arora and Sue Hung Fung As 5G wireless communications systems continue to be deployed, enterprises are busy planning for 6G—the next generation of wireless communications set to transform our lives. Poised to merge communication and computing, 6G promises to create a hyperconnected world that blends digital and physical experiences with ultra-fast speeds and low latency as a start... » read more

Challenges In Reducing Wireless Latency

By Karen Heyman - 10 Oct, 2024 - Comments: 0

A new and much faster version of Wi-Fi is beginning to infiltrate the IoT market, reducing latency that has begun to creep up as more data is generated, processed, and moved wirelessly from one device to another. An estimated 20 billion connected devices are currently in use. Over the next several years, devices will start to include faster wireless connectivity, enabling more rapid transfer... » read more

Energy Efficiency As A Native Network Attribute Through 6G

By Michele Robinson-Pontbriand - 29 Aug, 2024 - Comments: 0

Energy efficiency offers positive societal benefits in both environmental and economic ways, such as lowering pollutants and utility bills. As such, the global community is looking toward technological advancements to help drive a more sustainable future. One such technology that offers opportunities in this space is 6G. Utilizing its unparalleled speed and connectivity, and powered by the tran... » read more

6G And Beyond: Overall Vision And Survey of Research

By Technical Paper Link - 16 Jul, 2024 - Comments: 0

A new 92 page technical paper titled "6G: The Intelligent Network of Everything -- A Comprehensive Vision, Survey, and Tutorial" was published by IEEE researchers at Finland's University of Oulu. Abstract "The global 6G vision has taken its shape after years of international research and development efforts. This work culminated in ITU-R's Recommendation on "IMT-2030 Framework". While the d... » read more

How 6G Research Will Revolutionize Mobile Experiences

By Ben Coffin - 25 Apr, 2024 - Comments: 0

By 2030, 6G is expected to be commercially available, revolutionizing connectivity with lightning-fast speeds, unprecedented bandwidths, and ultra-low latencies. It will transform various sectors, including telecommunications, manufacturing, healthcare, transportation, and entertainment. In this article, get a glimpse of the 6G world coming to us over the next decade, and explore the 6G rese... » read more

The Need For Speed: Wi-Fi 7 And The Era Of Ultra-Fast Internet

By Alejandro Escobar Calderon - 09 Apr, 2024 - Comments: 0

The exponential growth of data consumption and the proliferation of connected devices have driven the need for the development of Wi-Fi 7. With the increasing demand for high-speed internet access, especially in bandwidth-intensive applications such as streaming, gaming, and virtual reality, existing wireless standards have become inadequate to meet the evolving needs of users. Wi-Fi 7 addresse... » read more

Reaching For The Stars: Embracing Non-Terrestrial Networks In The Age Of 5G And Beyond

By Alejandro Escobar Calderon - 12 Mar, 2024 - Comments: 0

In the realm of modern connectivity, the race towards faster, more reliable networks has been relentless. With the advent of 5G technology, humanity is on the brink of a new era of communication, promising unprecedented speeds and capabilities. However, as we stand on the precipice of this digital revolution, it's imperative to look beyond the terrestrial confines that have defined our networks... » read more

V2X Path To Deployment Still Murky

By Ann Mutschler - 07 Mar, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss Vehicle-To-Everything (V2X) technology and the path to deployment, with Shawn Carpenter, program director for 5G and space at Ansys; Lang Lin, principal product manager at Ansys; Daniel Dalpiaz, senior manager product marketing, Americas, green industrial power division at Infineon; David Fritz, vice president of virtual and hy... » read more

Research Bits: Feb. 19

By Jesse Allen - 19 Feb, 2024 - Comments: 0

DNA assembly of 3D nanomaterials Scientists from Brookhaven National Laboratory, Columbia University, and Stony Brook University developed a method that uses DNA to instruct molecules to organize themselves into targeted 3D patterns and produce a wide variety of designed metallic and semiconductor 3D nanostructures. “We have been using DNA to program nanoscale materials for more than a de... » read more

Bridging The Connectivity Gap: Unraveling The Complexities Of Wireless Standard Deployments

By Alejandro Escobar Calderon - 08 Feb, 2024 - Comments: 0

By Alejandro Escobar Calderon and John Ye In the fast-paced world of technological evolution, the deployment of wireless standards has been touted as the gateway to a connected future. The promise of lightning-fast wireless connectivity has been a driving force behind the relentless pursuit of cutting-edge standards such as 4G, 5G, and new network architectures like Open RAN (O-RAN). However... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?