Securing 5G And IoT With Fuzzing

By Synopsys - 04 Aug, 2021 - Comments: 0

5G will revolutionize many industries, with up to 100 times the speed, 100 times the capacity, and one-tenth the latency compared to 4G LTE. But in addition to providing superior performance, 5G expands the attack surface of apps and IoT devices that rely on this next-gen network. In addition to known security exploits, we’re bound to see unknown, novelty attacks. Fuzz testing (or fuzzing)... » read more

Wireless Test: Too Many Protocols

By Jeff Dorsch - 08 May, 2017 - Comments: 0

Testing wireless communications is getting far more difficult as more markets begin adding wireless communications and standards groups push to improve the speed, power and security of existing protocols. There is already a long list of protocols, and it's growing further as new communications technologies are added into the mix. With the addition of 5G, the new 802.11ax standard, and other ... » read more

Wireless Security Issues Grow

By Ernest Worthman - 01 May, 2014 - Comments: 0

The Internet, as we know it today, is still mostly an information highway. However, even as we speak, more and more once autonomous, physical objects are becoming intelligent. That includes the obvious ones, such as today’s smart communications devices, to the not so evident ones, such as pacemakers, vehicles, audio/video, and environmental sensors. There are microscopic cameras that are swal... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: WLAN

Securing 5G And IoT With Fuzzing

Wireless Test: Too Many Protocols

Wireless Security Issues Grow