Week in Review: IoT, Security, Auto

By Jeff Dorsch - 13 Jul, 2018 - Comments: 0

Deals ArterisIP inked a deal with Mobileye, which has bought multiple licenses for ArterisIP's interconnect and resilience technology for functional safety and AI hardware acceleration. Mobileye, which was purchased by Intel last year for $15.3 billion, will use the technology for ISO 26262/ASIL B and D SoCs. Siemens agreed to operate its MindSphere digital operating system on Alibaba Cloud... » read more

DAC’s Front Line…Soha, Chuck And Me

By Anne Cirkel - 14 Jul, 2014 - Comments: 1

In Brazil the drama continues, though that may be understating what happened yesterday. I’m still rendered nearly speechless by the result from Belo Horizonte, where all sorts of history was made. Of course I’m thrilled that Germany has a chance to win its first World Cup since 1990, though like much of Fussball-fandom I’m stunned and even a bit unnerved at how easy they made it look in t... » read more

Thoughts On DAC While Watching The World Cup

By Anne Cirkel - 03 Jul, 2014 - Comments: 0

Are you following the World Cup? I am. For those of you who don’t know me, I’m German, so soccer (rather, Fussball) is much more up my alley than football or baseball will ever be. When it comes to DAC planning, we are still at the fun, early stage of casting about widely for ideas and feedback. Mostly now we’re looking to prompt a bit of creative discussion, a challenge since the majo... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: World Cup

Week in Review: IoT, Security, Auto

DAC’s Front Line…Soha, Chuck And Me

Thoughts On DAC While Watching The World Cup

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