Research Bits: Oct. 29


Micro-LED DUV maskless lithography Researchers from the University of Science and Technology of China, Anhui GaN Semiconductor, and Wuhan University developed a vertically integrated micro-LED array for deep ultraviolet (DUV) maskless photolithography. The team fabricated a DUV display integrated chip with 564 pixels-per-inch density that uses a three-dimensional vertically integrated devic... » read more

2D materials–based homogeneous transistor-memory architecture for neuromorphic hardware


Abstract "In neuromorphic hardware, peripheral circuits and memories based on heterogeneous devices are generally physically separated. Thus exploring homogeneous devices for these components is an important issue for improving module integration and resistance matching. Inspired by ferroelectric proximity effect on two-dimensional materials, we present a tungsten diselenide-on-LiNbO3 cascaded... » read more

Power/Performance Bits: Feb. 23


Photonic AI accelerator There are now many processors and accelerators focused on speeding up neural network performance, but researchers at the University of Münster, University of Oxford, Swiss Federal Institute of Technology Lausanne (EPFL), IBM Research Europe, and University of Exeter say AI processing could happen even faster with the use of photonic tensor processors that can handle mu... » read more

Power/Performance Bits: June 23


Capturing waste heat Researchers at Wuhan University and University of California Los Angeles developed a hydrogel that can both cool down electronics and convert the waste heat into electricity. The thermogalvanic hydrogel consists of a polyacrylamide framework infused with water and specific ions. When they heated the hydrogel, two of the ions (ferricyanide and ferrocyanide) transferred e... » read more