tag: Zeiss

Fab Issues At 7nm And 5nm
By Mark LaPedus - 23 Jul, 2015 - Comments: 2

The race toward the 7nm logic node officially kicked off in July, when IBM Research, GlobalFoundries and Samsung jointly rolled out what the companies claim are the industry’s first 7nm test chips with functional transistors. They're not alone, of course. Intel and TSMC also are racing separately to develop 7nm technology. And in the R&D labs, chipmakers also are working on technologies f... » read more

Speeding Up E-beam Inspection
By Mark LaPedus - 18 Jun, 2015 - Comments: 0

Wafer inspection, the science of finding killer defects in chips, is reaching a critical juncture. Optical inspection, the workhorse technology in the fab, is being stretched to the limit at advanced nodes. And e-beam inspection can find tiny defects, but it remains slow in terms of throughput. So to fill the gap, the industry has been working on a new class of multiple beam e-beam inspectio... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 May, 2015 - Comments: 0

At an event, Samsung rolled out its 10nm finFET technology. The company also showed a 300mm wafer with 10nm finFET transistors. "We have silicon-based PDKs out," said Kelvin Low, senior director of foundry marketing for Samsung. Samsung plans to move into production with its 10nm finFET technology by the end of 2016, he said. IC Insights released its chip rankings in terms of sales in the fi... » read more

Manufacturing Bits: March 24
By Mark LaPedus - 24 Mar, 2015 - Comments: 0

Mouse brains to multi-beam At the recent SPIE Advanced Lithography conference, Sematech provided an update on its multi-beam, e-beam inspection program. The goal is to develop a next-generation inspection tool, which could be faster than traditional e-beam inspection and could one day displace brightfield inspection. “Optical inspection is having trouble detecting particles that are small... » read more

Challenges Mount For EUV Masks
By Mark LaPedus - 16 Oct, 2014 - Comments: 2

Five years ago, Intel urged the industry to invest millions of dollars in the photomask infrastructure to help enable extreme ultraviolet ([gettech id="31045" comment="EUV"]) lithography. At the time, there were noticeable gaps in EUV, namely defect-free masks and inspection tools. To date, however, Intel’s call to action has produced mixed results. The photomask industry is making progr... » read more

Debate Heats Up Over Bigger Glass
By Mark LaPedus - 17 Oct, 2013 - Comments: 0

For more than two decades, photomask makers have been talking about moving to a new and larger mask size, sometimes called “bigger glass” by the industry. Generally, the discussions about “bigger glass” have been all talk and no action. But now, some chipmakers are turning up the volume in the discussions and are pushing for a larger mask size. A larger mask size would require the ph... » read more

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