The consumer device market is witnessing incredible market space convergence between mobile handheld, automotive, and home electronics. IP vendors, engineers, and system design engineers face a multitude of challenges when designing and developing ICs, systems, or subsystems for the next great portable device. The next cell phone for instance, will not only be a multimedia player, but also a device that plays, stores, captures, and sends data 24/7 – whenever and wherever a user wants. Such flexible functionality requires hundreds, even thousands of embedded systems and subsystems to perform invisible work when called upon. With so much responsibility resting on these subsystems, the time has come for the industry to re-evaluate various IP design strategies and methodologies.
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Upcoming versions of high-bandwidth memory are thermally challenging, but help may be on the way.
Photonics, sustainability, and AI chips draw investment; 157 companies raised over $2.4 billion.
Why this 25-year-old technology may be the memory of choice for leading edge designs and in automotive applications.
Large language models and huge data volumes are prompting innovation at every level.
What will it take to achieve mass customization at the edge, with high performance and low power.
Apple security fix; Intel-Tower deal; Synopsys’ AI push; China’s trade violations; chip architecture shift; AMD buys AI Mipsology; TSMC’s photonics bet.
Semiconductors have become limited by heat. Good design can reduce it, and help dissipate it.
TSMC delays equipment buys; Cadence’s new AI-powered tools; iPhone 12 radiation woes; fab equipment spending; Arm’s IPO; Vietnam-U.S. partnership; Intel sells stake in mask writing biz to TSMC; new EV battery charges 80% in 10 mins.
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