The Week In Review: Design/IoT

Cadence rolls out 3D sound; NXP adds smarter car locks; Intel debuts wearable module; wireless charging groups merge.


Cadence rolled out a fourth-generation audio/voice DSP core for 32-bit DTS-X audio/voice processing, using multi-channel object-based audio. The technology allows for more textured 3D sound, while simplifying the steps for creating sound channels.

NXP rolled out a one-chip solution for smart car access, which combines passive keyless entry, an RF transmitter and an immobilizer. The company claims the system improves battery life by 40% with a 70% reduction in size, and supports walk-away locking.

Intel uncorked its Curie module, a wearable module based on the Quark microcontroller. The unit comes with a six-axis sensor, Bluetooth low-energy, and built-in memory. The company claims long battery life, but how long depends on the application.

Harman ported its audio analysis and restoration technology to Cadence‘s audio/voice DSPs. The technology reconstructs information lost during compression.

NXP is working with Cohda Wireless—a company in which it holds a stake—to develop vehicle-to-vehicle (V2V) communications technologies. In a high-speed test of their technology, two V2V-enabled Audis drove toward each other at a combined speed of up to 310 MPH, communicating information such as road hazards over a distance of more than 1.2 miles.

The Alliance for Wireless Power and the Power Matters Alliance agreed to merge to speed up the development of wireless charging technology. All of the major chipmakers are involved in this effort.

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