Intel Vs. Samsung Vs. TSMC
Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.
The Race To Glass Substrates
Replacing silicon and organic substrates requires huge shifts in manufacturing, creating challenges that will take years to iron out.
Controlling Warpage In Advanced Packages
Mechanical stresses increase with larger sizes and heterogeneous materials.
Legacy Process Nodes Going Strong
The critical, and growing, significance of mature node chips and processes.
3.5D: The Great Compromise
Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.
Key Technologies To Extend EUV To 14 Angstroms
Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.
Chip Industry Week In Review
Softbank's acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.
Chip Industry Week In Review
TI's CHIPS Act funding; security weaknesses in chip's lifecycle; Huawei's AI chip; TSMC's Arizona funding; DOE's IC energy efficiency; Eliyan's funding; NIST PQC tools/standards; smarter fabs; power models; CPU performance bottlenecks.
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