Highly Efficient Scan Diagnosis With Dynamic Partitioning


Charged with the task of improving yield, product engineers need to find the location of defects in manufactured ICs quickly and efficiently. Typically, they use volume scan diagnosis to generate large amounts of data from failing test cycles, which is then analyzed to reveal the location of defects. Scan failure data provides the basis for many decisions in the failure analysis and yield impro... » read more

Deprocessing And SEM For Semiconductor Failure Analysis


A typical semiconductor is fabricated from metal and barrier layers separated by passivation layers. A further glassivation and/or polyimide layer on top of these provides environmental and mechanical protection. Optical microscopes By using optical microscopy, the semiconductor die can be inspected for failure modes such as top-down visible crack degradation, melt-down of metal conductors,... » read more

SEM Analysis Reveals Real Cause Of Chip Failure


When it comes to ASIC design, DELTA’s motto is “first time right”. When the first wafers from the wafer fab showed severe electrical malfunction, we were extremely frustrated. To investigate the failure, the design team started electrical characterization of prototypes. Overall, a short between power and ground was observed and furthermore RF inputs exhibited strange VI characteristics. T... » read more

Failure Analysis Of Electronic Devices Using Scanning Acoustic Microscopy


Scanning acoustic microscopy, or SAM, is a non-destructive technique used in failure analysis of complex devices. SAM can provide a resolution down to sub-micron thicknesses. SAM is an efficient tool for analysis of adhesion between layers and presence of possible flaws in each layer. This can be used e.g. for investigations of sealing, coating, flip-chip underfills, BGA, QFN, wafer to wafer ... » read more

Breakthrough For Scan Diagnosis With Machine Learning


Cell-aware diagnosis is a new and effective way to detect defects inside standard cells. Industry standard failure analysis (FA) results from a major foundry show that cell-aware diagnosis is very effective at increasing the resolution of the diagnosis by reducing the number of suspects in cell-internal defect data. With advanced technology nodes, we have more complex layout structures and f... » read more

A Different Approach To Failure Analysis


Decapsulation of plastic IC packages in different types and size were performed by wet chemical technique. Studied devices were to use in satellites and going to subject a series of test which require the die to be exposed. Different package types with changing sizes and bonding types such as Au- and Cu-bonded packages for unmounted and PCBA-mount components were successfully achieved. A combin... » read more

Moving Beyond Geometries: Context-Aware Verification Improves Design Quality And Reliability


Context-aware checks integrate physical and electrical information to evaluate a wide range of design conditions, from advanced design rule compliance, to circuit and reliability verification, to design optimization and finishing. Automated context-aware checking provides designers with actionable results that improve both debugging efficiency and verification precision. Introduction Many p... » read more

X-Ray Reveals Wire Bonding And Field Failures


Wire bonding is widely used for first-level interconnection of semiconductor die to component leads or pads. It is vital that the interconnection corresponds to the product-specific bonding diagram and that the wire bonding is of an acceptable robustness and quality. X-ray technology is critical for ensuring both. To read more, click here. » read more

Failure Analysis of a Product—Not Only a Component


Classic failure analysis (FA) technique generally deals with a single failed component in a complete product to detect the root cause of failure. This approach is inexpensive and less time-consuming. However, this may end up with a wrong interpretation of the product failure or overlooking the synergetic effect of different components related to the failure. This article is about a product on ... » read more

Avoiding Down Times: Monitoring, Diagnostics And Troubleshooting Of Industrial Wireless Systems


The ever-growing proliferation of wireless devices and technologies used for Internet of Things (IoT) applications, such as patient monitoring, military surveillance, and industrial automation and control, has created an increasing need for methods and tools for connectivity prediction, information flow monitoring, and failure analysis to increase the dependability of the wireless network. Inde... » read more

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