tag: failure analysis

IC Reliability Burden Shifts Left
By Ann Mutschler - 23 Jun, 2022 - Comments: 0

Chip reliability is coming under much tighter scrutiny as IC-driven systems take on increasingly critical and complex roles. So whether it's a stray alpha particle that flips a memory bit, or some long-dormant software bugs or latent hardware defects that suddenly cause problems, it's now up to the chip industry to prevent these problems in the first place, and solve them when they do arise. ... » read more

Big Payback For Combining Different Types Of Fab Data
By Anne Meixner - 07 Dec, 2021 - Comments: 1

Collecting and combining diverse data types from different manufacturing processes can play a significant role in improving semiconductor yield, quality, and reliability, but making that happen requires integrating deep domain expertise from various different process steps and sifting through huge volumes of data scattered across a global supply chain. The semiconductor manufacturing IC data... » read more

Autoencoder-Based Characterisation Of Passive IEEE 802.11 Link Level Measurements
By Fraunhofer IIS/EAS - 10 Nov, 2021 - Comments: 0

Wireless networks are indispensable in today’s industrial manufacturing and automation. Due to harsh signal propagation conditions as well as co-existing wireless networks, transmission failures resulting in severe application malfunctions are often difficult to diagnose. Remote wireless monitoring systems are extremely useful tools for troubleshooting such failures.However, the completeness ... » read more

How To Identify Common Electronic Failures
By Tyler Ferris - 14 Oct, 2021 - Comments: 0

Failure analysis is the process of identifying, and typically attempting to mitigate, the root cause of a failure. In the electronics industry, failure analysis involves isolating the failure to a location on a printed circuit board assembly (PCBA) before collecting more detailed data to investigate which component or board location is functioning improperly. A member of the Ansys Reliabil... » read more

Industry 4.0 And The Rise Of QPaaS
By Optimal Plus - 10 Nov, 2020 - Comments: 0

McKinsey & Company frames this shift as a matter of moving the industry from its current approach of “firefighting” – responding to failures and vulnerabilities after they’re brought to OEMs’ attention – toward proactively preventing such episodes in the first place. How can the industry achieve this objective? By embracing quality protection as a service (QPaaS) — an approach... » read more

Dependent Failure Analysis For Safety-Critical IP And SoCs
By Shivakumar Chonnad - 02 Nov, 2020 - Comments: 0

By Shivakumar Chonnad, Radu Iacob, and Vladimir Litovtchenko Due to the increased complexity in safety-critical system hardware, software, and mechatronics, the functional safety development process must address systematic and random hardware failures. Numerous safety-related activities are performed during safety-critical IP and SoC developments, as part of the safety lifecycle, from produc... » read more

Failure Analysis Becoming Critical To Reliability
By Ed Sperling - 11 Feb, 2020 - Comments: 0

Failure analysis is rapidly becoming a complex, costly and increasingly time-consuming must-do task as demand rises for reliability across a growing range of devices used in markets ranging from automotive to 5G. From the beginning, failure analysis has been about finding out what went wrong in semiconductor design and manufacturing. Different approaches, tools and equipment have improved ov... » read more

Highly Efficient Scan Diagnosis With Dynamic Partitioning
By Jayant D'Souza - 10 Sep, 2019 - Comments: 0

Charged with the task of improving yield, product engineers need to find the location of defects in manufactured ICs quickly and efficiently. Typically, they use volume scan diagnosis to generate large amounts of data from failing test cycles, which is then analyzed to reveal the location of defects. Scan failure data provides the basis for many decisions in the failure analysis and yield impro... » read more

Deprocessing And SEM For Semiconductor Failure Analysis
By Helle Ronsberg - 09 Jul, 2019 - Comments: 0

A typical semiconductor is fabricated from metal and barrier layers separated by passivation layers. A further glassivation and/or polyimide layer on top of these provides environmental and mechanical protection. Optical microscopes By using optical microscopy, the semiconductor die can be inspected for failure modes such as top-down visible crack degradation, melt-down of metal conductors,... » read more

SEM Analysis Reveals Real Cause Of Chip Failure
By DELTA, a part of FORCE Technology - 08 Jul, 2019 - Comments: 0

When it comes to ASIC design, DELTA’s motto is “first time right”. When the first wafers from the wafer fab showed severe electrical malfunction, we were extremely frustrated. To investigate the failure, the design team started electrical characterization of prototypes. Overall, a short between power and ground was observed and furthermore RF inputs exhibited strange VI characteristics. T... » read more

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