Capture wire bonding defects in molded integrated circuits (IC) in microelectronics.
Wire bonding, a foundational process in microelectronics, is essential to establishing a robust and low-resistance electrical connection between semiconductor chips and their respective packages or, in the case of multi-chip modules, between different chips. This intricate process ensures the device’s functionality, reliability, and overall performance.
Wire bonding faces several challenges that become more critical as technology advances. Firstly, the miniaturization in the semiconductor industry has led to shrinking components, significantly increasing the complexity of wire bonding processes. Secondly, the trend towards high-density packaging, aimed at integrating more functions per unit area, presents difficulties in wire placement and avoiding wire-to-wire shorting. Additionally, material compatibility issues can arise, where different materials might react over time, leading to degradation and potentially compromising the integrity of connections.
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Fig.1: Cross-sectional view of wire bond testing using Keysight’s VTEP technology.
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