Get a quick overview of 130 BCDLite and BCD—130nm 1.5V to 85V process technologies.
BCDLite and BCD process technologies offer a modular platform architecture based on the Globalfoundries’s low-power logic process with integrated low- and high-voltage bipolar transistors, high-voltage EDMOS/LDMOS transistors, precision analog passives and non-volatile memory.
• New Gen2 release with significant performance improvements
• BCDLite is tailored for cost-effective mobile/consumer applications: DC-DC, AC-DC, PMIC, Wireless and Quick Charging
• BCD high-temp rated transistors and rugged power devices are ideal for industrial and automotive applications
• High performance power and high-voltage transistors
• Integration of separate digital controllers and analog/power ICs into mixed-signal solutions.
BCDLite applications vary widely, ranging from full analog to integrated solutions. As the percentage of digital content increases, it puts a premium on smaller feature sizes to control die area and cost. GF offers a full range of feature sizes to help you find the right choice for each application.
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Rising costs and gaps in equipment emerge as technology scales; new tools under development.
Experts at the Table, part 1: Shrinking features isn’t enough anymore. The big challenge now is how to achieve economies of scale and minimize complex integration issues.
Explosion of data is forcing significant changes in where processing is done.
New market opportunities and global competitiveness are limited by qualified people.
Researchers digging into ways around the von Neumann bottleneck.
The promise of advanced packaging is being able to integrate heterogeneous chips, but a lot of work is needed to make that happen.
Better algorithms and more data could bolster adoption, particularly at advanced nodes.
30 facilities planned, including 10/7nm processes, but trade war and economic factors could slow progress.
New architectures, packaging approaches gain ground as costs increase, but shrinking features continues to play a role.
Improvement still needed for uptime, defectivity, line edge roughness and process flows.
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