December 2010 - Page 3 of 3 - Semiconductor Engineering

Race Intensifies To Develop EUV Source

By Ed Sperling - 02 Dec, 2010 - Comments: 0

By David Lammers The technology competition to supply the source of EUV radiation for the next-generation lithography tools has long been divided between the laser-produced plasma (LPP) approach, favored by Cymer (San Diego) and Gigaphoton (Oyama, Japan), and the discharge -produced plasma (DPP) method supported by Xtreme Technologies (Aachen, Germany). The competition is heating up, and it... » read more

3D Stacked Die Create Unique Test Issues

By Ed Sperling - 02 Dec, 2010 - Comments: 0

By Ann Steffora Mutschler While 3D die stacking promises a number of benefits including smaller footprint, faster speed, lower power and possibly lower cost, testing those devices isn’t going to be simple. There are varying degrees of challenges aligned with varying types of defects that occur throughout the process, from wafer fabrication to package assembly to system-level assembly. And... » read more

The Growing Legacy Of Moore’s Law

By Ed Sperling - 02 Dec, 2010 - Comments: 0

By Ed Sperling Moore’s Law has defined semiconductor design since it was introduced in 1965, but increasingly it also has begun defining the manufacturing equipment, the cooling needed for end devices, and both the heat and performance of systems. In the equipment sector the big problem has been the delay in rolling out extreme ultraviolet (EUV). Moore’s Law will require tighter spacing... » read more

Power Optimization Below 28nm

By Ed Sperling - 02 Dec, 2010 - Comments: 0

By Pallab Chatterjee Process scaling has normally been performed on a lithographic basis, but as processes dip below 32nm there are optimization options beyond the lithographic and area reduction. The Common Platform Group and GlobalFoundries have added the tradeoffs of power and performance optimization in addition to area in their 28nm flows. TSMC uses a five-way optimization that also h... » read more

Experts At The Table: IP Integration Hurdles

By Ed Sperling - 02 Dec, 2010 - Comments: 0

By Ed Sperling Low-Power Engineering sat down to discuss IP integration issues with Ken Brock, senior staff product marketing manager for logic libraries in Synopsys’ Solutions Group; Kalar Rajendiran, senior director of marketing at eSilicon; Mike Gianfagna, vice president of marketing at Atrenta; and Jim McCanny, CEO of Altos Design Automation. What follows are excerpts of that conversatio... » read more

The Trouble With Semiconductor IP

By Ed Sperling - 01 Dec, 2010 - Comments: 0

Low-Power Engineering takes a poll of the big problem with IP and how to solve it from Ken Brock, senior staff product marketing manager at Synopsys; Kalar Rajendiran, senior director of marketing at eSilicon; Mike Gianfagna, vice president of marketing at Atrenta, and Jim McCanny, CEO of Altos Design. [youtube vid=b7wnkY_rU04] » read more

Silence Is Golden

By Ann Mutschler - 01 Dec, 2010 - Comments: 0

As the industry continues to march along building devices with ever-increasing battery life, it is necessary to migrate to the latest and greatest process nodes, which as we all know are smaller and use lower voltages. However, any noise in the system—whether it was there before or you start to use something like USB 3.0 or SATA or something else—is actually going to increase the number of ... » read more

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