April 2011 - Page 4 of 5 - Semiconductor Engineering


Experts At The Table: Verification At 28nm And Beyond


Low-Power Engineering sat down to discuss issues in verification at 28nm and beyond with Frank Schirrmeister, director of product marketing for system-level solutions at Synopsys, Ran Avinun, marketing group director at Cadence, Prakash Narain, president and CEO of Real Intent, and Lauro Rizzatti, general manager of EVE-USA. What follows are excerpts of that conversation. LPE: Power seems to... » read more

Verification At 28nm And Beyond


Low-Power Engineering looks at the challenges ahead in IC verification with Frank Schirrmeister of Synopsys, Ran Avinun of Cadence, Prakash Narain from Real Intent and Lauro Rizzatti from EVE. [youtube vid=bc5IhGrlJo4] » read more

Wanted: ESL Power Design Flow


In order to truly incorporate understanding of power at a higher-than-RTL level of abstraction, a new design flow is needed—and it won’t come from just one vendor. Apache believes that tool flow must contain ESL simulation, ESL synthesis to RTL along with RTL power analysis using ESL simulation results. The company maintains that this very approach has been demonstrated successfully by w... » read more

Still Room at the Bottom


Fifty years ago today, Russian cosmonaut Yuri Gagarin became the first human to leave Earth and enter space. (He was perfectly qualified for the job: he was short, and was willing to sit there and do nothing as he was hurled like a cannon ball into space.) If sputnik awoke the world to the technical possibilities of space, Gagarin awoke our sense of awe and adventure for space. I grew up in the... » read more

Finally! Solid Data For The Semiconductor Secondary Equipment Market


By Joanne Itow The semiconductor industry grabs headlines as companies such as Intel announce the construction of multi-billion-dollar state-of-the-art research and manufacturing facilities. High performance servers, PCs and most of our electronic devices would not exist today if it weren’t for the continual advancements made in semiconductor manufacturing technology. While the most advanced... » read more

Japan Earthquake: The Industry Will Respond and Rebound


By Stanley T. Myers, president and CEO, SEMI The massive earthquake, tsunami and power plant disaster in Japan has brought great sadness to the semiconductor industry, as it has to people all over the world. Japan is a pioneer and leader in the global chip industry whose contributions are valued the world over. SEMI and our member companies extend our deepest condolences to our friends and c... » read more

MEMS on SOI – Growing Fast and Faster


By Adele Hars In the latest ASN posting by Dr. Eric Mounier of Yole Developpement, “SOI for MEMS: A Promising Material”, he notes that SOI MEMS is growing at a CAGR (2011-2015) of 15.6%, compared to 8.1% for bulk silicon-based solutions. MEMS designers are doing amazing things on SOI – which would explain that impressive growth rate. [caption id="attachment_12" align="aligncenter... » read more

Experts At The Table: Yield Issues


By Ed Sperling Semiconductor Manufacturing & Design sat down to discuss yield with Amiad Conley, technology marketing manager for yield and process control at Applied Materials; Cyrus Tabery, senior member of the GlobalFoundries technical staff for lithography development and DFM; Brady Benware, engineering manager for diagnosis and yield at Mentor Graphics, and Ankush Oberai, general man... » read more

Forecasting Wafer Demand: Technology Migration, Bottlenecks and Confetti


By Joanne Itow If you cover a long enough time period, the small ups and downs of a graphed line can look very smooth. Semico’s semiconductor wafer demand data goes back to 1991. When wafer demand is graphed from 1991 to 2016, wafer growth appears to have a very steady upward trend with only a few minor interruptions. Wafer demand grows at a compound annual growth rate of about 8-9%. When ... » read more

Behind The Analog Frenzy


Analog is suddenly very hot again, and much of it appears to be due to the promise of 2.5D and 3D stacking. Texas Instruments pulled out its checkbook to pay $6.5 billion for National Semiconductor, and Microsemi has offered $28 million for AML Communications, which makes low-noise and high-power microwave amplifiers. So what’s behind these move? In TI’s case, there appears to be a re... » read more

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