August 2011 - Page 3 of 3 - Semiconductor Engineering

Hierarchical LP Design 2
By Luke Lang - 11 Aug, 2011 - Comments: 0

By Luke Lang Last month, I discussed two key features of the Common Power Format (CPF) that support hierarchical design methodology: boundary port and macro model. These are commands that need to be written to describe the power intent and drive the tools. Without these commands, it is extremely difficult to do hierarchical design. But with these commands, hierarchical power intent files are n... » read more

Interconnect Power
By Barry Pangrle - 11 Aug, 2011 - Comments: 0

By Barry Pangrle Applied Materials announced its latest version of nano-porous low-k dielectric technology called Black Diamond 3 last month at Semicon West. What really caught my ear though was the marketing claim that 1/3 of total chip power consumption (really energy) is in the interconnect. I thought about this a bit, and certainly for some designs this seemed to easily be quite po... » read more

Intelligent Integration Intent
By Ed Sperling - 11 Aug, 2011 - Comments: 0

The focus in recent mobile designs has been heavily slanted toward energy efficiency and power reduction, but this is merely a swing of the pendulum. The loudest complaint right now is time between battery charges, and devices that can go longer between charges without having to turn down the screen brightness, turn off Bluetooth and limit the number of e-mail refreshes will win market share. ... » read more

Experts At The Table: Multi-Core And Many-Core
By Ed Sperling - 11 Aug, 2011 - Comments: 0

By Ed Sperling Low-Power Engineering sat down with Naveed Sherwani, CEO of Open-Silicon; Amit Rohatgi, principal mobile architect at MIPS; Grant Martin, chief scientist at Tensilica; Bill Neifert, CTO at Carbon Design Systems; and Kevin McDermott, director of market development for ARM’s System Design Division. What follows are excerpts of that conversation. LPE: How does cloud computing... » read more

Apache Update: Five Important Questions
By Ed Sperling - 11 Aug, 2011 - Comments: 0

By Ed Sperling It was supposed to be the first IPO since Magma went public in 2001. Instead, Apache was bought by Ansys in a deal that closed earlier this month—at a record pace for the EDA industry of less than two months since it was announced. So what exactly was behind the acquisition and why did Apache agree to sell? And what will become of Apache within the much larger Ansys? Low... » read more

Don’t Forget Test
By Ann Mutschler - 11 Aug, 2011 - Comments: 0

In the modeling of designs for power, engineers make sure to include real system modes and get real activity vectors but, according to Pete Hardee at Cadence, there are a few things they are forgetting. “If the only activity you are using is your simulation test vectors, those are probably pretty unrealistic and that’s a big source of error. One other thing we see—and this is quite imp... » read more

The Other Green
By Ed Sperling - 05 Aug, 2011 - Comments: 0

The human memory is rather short when it comes to certain things. Energy efficiency is one of them. While they may cringe at paying $4 a gallon for gasoline to fill of their car, they were convinced that drastic measures were necessary when gas hit $1 a gallon. And while consumers collectively account for the vast percentage of energy consumed, individually they don’t consume enough to mak... » read more

Industry Leaders See a Promising but Challenging Future
By Tom Morrow - 04 Aug, 2011 - Comments: 0

By Tom Morrow “The challenge with all these technologies is that we cannot decouple them from the economics,” said Rick Wallace, president and CEO of KLA-Tencor during the annual Executive Summit at SEMICON West. While aligning the economics of new production technologies such as EUV, III-V materials, FinFETS, and 450 mm wafers have yet to be fully worked out, the insatiable appetite for... » read more

Study Shows FD-SOI Most Cost-Effective Approach at 22nm
By Various Writers - 02 Aug, 2011 - Comments: 0

By Adele Hars What are you doing at 22nm? The debate is raging in the press and forums alike. Now research firm IC Knowledge has issued a report showing that from a straight cost perspective, planar FD-SOI is a better choice than bulk. We’ve known for a while that sticking with bulk at the 22nm node would get pretty complicated. This study shows just how complicated bulk will be: abou... » read more

What’s A Cell Phone?
By Ed Sperling - 01 Aug, 2011 - Comments: 0

By Ed Sperling Just because a smart phone is sold by Verizon or AT&T mobile no longer means that it will be used primarily as a phone. That distinction may sound trivial, but it has deep implications for the components that are used inside of these devices, how they’re used, and who wins the designs. Shifts such as this can also lead to broad changes in who buys the tools to develop the ... » read more

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