June 2013 - Page 5 of 6 - Semiconductor Engineering

New Standard!
By Barry Pangrle - 13 Jun, 2013 - Comments: 0

It’s been a little over four years since the first IEEE 1801 standard was officially published in March 2009, but the standard can trace its roots back to years before that date. On May 30th, the IEEE released a press announcement for the newest version of the standard, IEEE 1801-2013 (a.k.a. UPF 2.1). It takes a considerable amount of effort and attention to detail to produce a solid standar... » read more

Pushing The Limits
By Ed Sperling - 13 Jun, 2013 - Comments: 0

Ever since the turn of the millennium, researchers have been warning that wires and interconnects will have issues. Electron crashes were reported as early as 2001, and electromigration is rising to the forefront of problems at advanced nodes. The result? Chipmakers are looking at thicker wires for the first time as a way of dealing with resistance and capacitance issues. While this makes se... » read more

Challenges In IC And Electronic Systems Verification
By Aveek Sarkar - 13 Jun, 2013 - Comments: 0

In the first two parts of this series, we reviewed the challenges design teams face as they grapple with increasing power consumption, tighter schedules and the drive to reduce costs. Both a top-down and a bottom-up analysis framework were proposed to help control these challenges. In part 2 of this series, specific challenges were outlined including power budgeting, power and signal integrity,... » read more

Apple’s Big Breakthrough
By Synopsys - 13 Jun, 2013 - Comments: 0

By Cary Chin For literally years now, we’ve talked about and measured energy consumption as smartphones have morphed from primarily communications devices (voice), to the world’s most widespread computing platform, and back again to a communications focus. But this time it’s data communications, and voice calls are just a small subset. Smartphones themselves, once the defining standar... » read more

Reflecting on the Future
By Ann Mutschler - 13 Jun, 2013 - Comments: 0

Since returning from the Design Automation Conference, I’ve been reflecting on some very interesting discussions I had last week in Austin. The ones that are sticking with me concern the old, sequential algorithms that run EDA tools today. The fact is, given design complexity, they are running out of steam. As a result, the industry is looking at possibly leveraging GPUs since they may be ... » read more

Hierarchy And Pain Management
By Bernard Murphy - 10 Jun, 2013 - Comments: 0

By Bernard Murphy Hierarchy is unavoidable for any large design. It partitions development and verification complexity into digestible chunks. It enables parallel development on different parts of a system. It promotes reuse. And it provides a graceful method to partition for implementation. And yet, there are times when hierarchy gets in the way. The biggest drawback with hierarchy is that... » read more

Experts At The Table: Nice To Have Vs. Need To Have
By Ed Sperling - 10 Jun, 2013 - Comments: 0

Low-Power Engineering sat down to discuss what’s essential and what isn’t in EDA with Brani Buric, executive vice president at Virage Logic; Kalar Rajendiran, senior director of marketing at eSilicon; Mike Gianfagna, vice president of marketing at Atrenta, and Oz Levia, vice president of marketing and business development at Springsoft. What follows are excerpts of that conversation. LPE... » read more

Fab Equipment Spending To Rise
By Christian Dieseldorff - 07 Jun, 2013 - Comments: 0

By Christian Gregor Dieseldorff Fab equipment spending will grow two percent year-over-year (US$ 32.5 billion) for 2013 and 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast. Fab construction spending, which can be a strong indicator for future equipment spending, is expected to grow 6.5 percent ($6.6 billion) in 2013, followed by a decline of 1... » read more

The Week In Review: June 7
By Ed Sperling - 07 Jun, 2013 - Comments: 0

By Ed Sperling For all the hesitation about moving the Design Automation Conference to Austin, it turns out that Austin has a lot of hardware engineers. In fact they flooded into the conference, turning it into one of the most successful in recent years and setting new records in multiple areas. Even Texas Gov. Rick Perry showed up to see what all the fuss was about. Mentor Graphics added c... » read more

Experts At The Table: The Growing Signoff Headache
By Ed Sperling - 07 Jun, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss signoff issues with Rob Aitken, an ARM fellow; Sumbal Rafiq, director of engineering at Applied Micro; Ruben Molina, product marketing director for timing signoff at Cadence; Carey Robertson, director of product marketing for Calibre extraction at Mentor Graphics; and Robert Hoogenstryd, director of marketing for design ... » read more

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