August 2013

The Week In Review: Aug. 30

By Ann Steffora Mutschler Continuing its drive towards enabling the Internet of Things (IoT), Renesas recently licensed a third Tensilica core from Cadence, this time the ConnX D2 DSP, which has acceleration packages optimized for IoT wired and wireless modem standards. Renesas previously licensed the Tensilica HiFi Audio DSP and ConnX BBE16 cores. In another deal for Cadence, Mellanox Tech... » read more

Experts At The Table: Next-Generation IP Landscape

By Ann Steffora Mutschler System-Level Design sat down to discuss predictions about the next generation design IP landscape with Robert Aitken, R&D fellow at ARM; Laurent Moll, chief technical officer at Arteris; Susan Peterson, group director, product marketing for verification IP & memory models in the system & software realization group at Cadence; and John Koeter, vice preside... » read more

Manufacturing Bits: Aug. 27

Growing tubes Single-wall carbon nanotubes could one day be used in electronics, optoelectronics, biomedical imaging and other applications. But the synthesis of nanotubes with defined chiralities has been a stumbling block. A chiral molecule is a molecule that has a non-superposable mirror image. The University of Southern California has shown that chirality-pure short nanotubes can be use... » read more

Power/Performance Bits: Aug. 27

Möbius strip ties liquid crystal in knots By tying knots in liquid crystals using a miniature Möbius strip made from silica particles, University of Warwick researchers hope to understand how their intricate configurations and unique properties can be harnessed in the next generation of advanced materials and photonic devices. Given that liquid crystal is an essential material in modern l... » read more

System Bits: Aug. 27

Material that conducts and insulates It is well known to scientists that the three common phases of water – ice, liquid and vapor – can exist stably together only at a particular temperature and pressure, called the triple point. Also well known is that the solid form of many materials can have numerous phases, but it is difficult to pinpoint the temperature and pressure for the points at ... » read more

The Week In Review: Aug. 26

By Mark LaPedus The evolving relationship between humans and machines is the key theme of Gartner’s most "hyped” technologies in 2013. Gartner has chosen to feature the relationship between humans and machines due to the increased hype around smart machines, cognitive computing and the Internet of Things. Gartner also released its updated chart of hyped technologies. SunEdison, formerly... » read more

Experts At The Table: Low-Power Verification

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss power format changes with Sushma Hoonavera-Prasad, design engineer in Broadcom’s mobile platform group; John Biggs, consultant engineer for R&D and co-founder of ARM; Erich Marschner, product marketing manager at Mentor Graphics; Qi Wang, technical marketing group director at Cadence; and Jeffrey Lee, corporate ap... » read more

Experts At The Table: Challenges At 20nm

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss the challenges at 20nm and beyond with Jean-Pierre Geronimi, special projects director at STMicroelectronics; Pete McCrorie, director of product marketing for silicon realization at Cadence; Carey Robertson, director of product marketing at Mentor Graphics; and Isadore Katz, president and CEO of CLK Design Automation. Wh... » read more

The Week In Review: Aug. 23

By Ed Sperling Cadence won a deal with Realtek, which licensed the Tensilica HiFi audio DSP core for voice recognition technology. Fast voice triggers have been possible for some time, but being able to combine that with low power for mobile devices isn’t easy because the devices are always on—or at least enough “on” to pick up voice commands. Mentor Graphics turned in a record-bre... » read more

The Case For Extensible Processors

By Neil Hand In a previous post I talked about how intelligent subsystems are going to impact overall system design. Because many more design teams are going to be required to implement complex processing power into there subsystems, I thought it time to expand on that topic and talk a little about options available to add that intelligence. One size does not fit all The traditional approa... » read more

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