September 2013 - Page 8 of 9 - Semiconductor Engineering

System Bits: Sept. 10
By Ann Mutschler - 10 Sep, 2013 - Comments: 0

Enabling flexible touchscreens While transparent conductors make touchscreens possible, the cost and the physical limitations of the material these conductors are usually made of are hampering progress toward flexible touchscreen devices but a research collaboration between the University of Pennsylvania and Duke University has shown a new a way to design transparent conductors using metal nan... » read more

Power/Performance Bits: Sept. 10
By Ann Mutschler - 10 Sep, 2013 - Comments: 0

Using DNA to assemble transistors from graphene Graphene is a sheet of carbon atoms arrayed in a honeycomb pattern, just a single atom thick. It could be a better semiconductor than silicon – if we could fashion it into ribbons 20 to 50 atoms wide. Could DNA help? Stanford chemical engineering professor Zhenan Bao, believes it could. Bao and her team of researchers hope to solve a problem... » read more

Materials Innovation Key To Enabling Next-Generation Mobile Devices
By Kathryn Ta - 09 Sep, 2013 - Comments: 0

By Kathryn Ta There’s a lot of excitement building regarding several new mobile product announcements on the horizon, including a concept smartwatch, a new phablet and a new smartphone. These products are sure to be on a lot of consumers’ wish lists this holiday season, and users will expect them to have a sleeker look and feel, while running applications instantly, providing all-day batte... » read more

The Week In Review: Sept. 9
By Mark LaPedus - 09 Sep, 2013 - Comments: 0

By Mark LaPedus SK Hynix’ DRAM fab in China caught on fire. The fire caused one minor injury, but it did not impact the equipment, according to reports. SK Hynix will re-open the fab soon, according to reports. Bob Halliday, Applied Materials’ CFO, gave a presentation at an analyst event, saying: “I think there’s probably more technology inflections going on right now than in years.... » read more

A Different Kind Of Bottleneck
By Ed Sperling - 07 Sep, 2013 - Comments: 0

Electronics have always lived in troubling times. There have been threats of outsourcing, not to mention re-outsourcing from the outsourcers, constant pressure from startups from around the globe, pricing pressures, government intervention, technological issues, and rising complexity that is now forcing a complete re-thinking of the supply chain. More recently, the demand has been for mobility,... » read more

The Week In Review: Sept. 6
By Ed Sperling - 06 Sep, 2013 - Comments: 0

By Ed Sperling ARM acquired Cadence’s high-resolution display processor cores, which it helped to co-develop. Coupled with ARM’s own graphics, the move sets up ARM to sell complete subsystems. Cadence also won a deal with SMIC, which is using Cadence’s low-power flow and signoff technology for its 40nm process. Mentor Graphics won a deal with Advanced Wireless Semiconductor Co., whic... » read more

Performance Or Power?
By Ed Sperling - 06 Sep, 2013 - Comments: 0

For high-volume chips, such as those slated for mobile devices such as tablets or smart phones, energy efficiency is absolutely critical. For very high-value chips, which are the ones that show up in PCs or servers, the focus is more on performance and how efficiently that performance is obtained. And for the stuff in the middle, notably the Internet of things, the commodity servers and automot... » read more

Experts At The Table: Process Technology Challenges
By Mark LaPedus - 05 Sep, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future transistor, process and manufacturing challenges with Subramani Kengeri, vice president of advanced technology architecture at GlobalFoundries; Carlos Mazure, chief technical officer at Soitec; Raj Jammy, senior vice president and general manager of the Semiconductor Group at Intermolecular; and Girish Dixit, v... » read more

Blog Review: Sept. 4
By Ed Sperling - 04 Sep, 2013 - Comments: 0

By Ed Sperling Cadence’s Brian Fuller looks at the opportunity for EDA in the cloud and where it’s most likely to gain traction. How about the PCB? Synopsys’ Mick Posner has moved beyond broad-based design ecosystems. He’s now reaching out to local neighborhoods with FPGA prototypes. Sounds like quality family time. Mentor’s Colin Walls concedes that all non-trivial software ... » read more

The Week In Review: Sept. 3
By Mark LaPedus - 03 Sep, 2013 - Comments: 0

By Mark LaPedus The cellular chip supplier landscape is littered with corpses. So will 4G lead to the destruction of Qualcomm and Intel? That’s highly unlikely, according to a blog from Strategy Analytics. “With the recent announcement of a multimode LTE chipset from Intel, it seems likely that Qualcomm and Intel will maintain their status as the top two cellular radio chipset suppliers in... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy