January 2014 - Page 3 of 10 - Semiconductor Engineering

Virtual Prototypes For Early Software Development
By Various Writers - 29 Jan, 2014 - Comments: 0

This white paper examines tthe challenges of developing some of the hardware-dependent software layers - namely boot ROM code, OS bring-up, driver development - used in fast-evolving mobile devices and how to use virtual prototypes to: Start developing software far in advance of hardware availability Break the gating dependencies between layers in the software stack to enable parallelized... » read more

Manufacturing Bits: Jan. 28
By Mark LaPedus - 28 Jan, 2014 - Comments: 0

Spintronics gains traction The field of spintronics is gaining interest. The technology could enable a new class of spin-based devices, which combine the switching speeds of logic and the non-volatility of memory. Controlling the magnetism by means of electric fields is the key for future devices, but the ability to switch ferromagnetism technology at room temperature is challenging. Helmho... » read more

System Bits: Jan. 28
By Ann Mutschler - 28 Jan, 2014 - Comments: 0

Collaborative software for linking performance, cost Researchers from Georgia Tech have created a web-based tool that lets physically-separated participants collaborate on model-based systems engineering projects. Referred to as the Framework for Assessing Cost and Technology (FACT), the program utilizes open-source software components to allow users to visualize a system's potential expens... » read more

Power/Performance Bits: Jan. 28
By Ann Mutschler - 28 Jan, 2014 - Comments: 0

E-whiskers From the world of nanotechnology, researchers with Berkeley Lab and UC Berkeley are on the verge of electronic whiskers -- tactile sensors from composite films of carbon nanotubes and silver nanoparticles similar to the highly sensitive whiskers of cats and rats. These new e-whiskers respond to pressure as slight as a single Pascal, which is about the amount of pressure exerted o... » read more

Experts At The Table: Yield And Reliability Issues With Integrating IP
By Ed Sperling - 27 Jan, 2014 - Comments: 1

Semiconductor Engineering sat down to discuss the impact of integrating IP in complex SoCs with Juan Rey, senior director of engineering at Mentor Graphics; Kevin Yee, product marketing director for Cadence’s SoC Realization Group; and Mike Gianfagna, vice president of marketing at eSilicon. What follows are excerpts of that conversation. SE: As an industry we’ve got a pretty good grasp ... » read more

2014 Accellera Standards Are Built on Powerful Shoulders
By Accellera - 27 Jan, 2014 - Comments: 0

By Adam Sherer Looking out at the fresh snow coating the landscape here in Buffalo, it’s tempting to look toward 2014 and focus only on the fresh and new. However, if I’ve learned anything about this city from the day I arrived here as a freshman EE in 1984, it’s that you don’t bury your foundation. Instead, you recognize it as your greatest strength, the powerful shoulders upon whic... » read more

A Perspective On Open Process Specification
By Ted Paone - 27 Jan, 2014 - Comments: 2

It is the job of the Process Design Kit (PDK) engineers to deliver a high-quality PDK that properly represents the process requirements and constraints and supports the design flows used by their customers. The PDK engineer takes multiple inputs describing the process and the devices and circuitry in the process and generates the output in the form of OpenAccess technology libraries (techDB), d... » read more

Tech Talk: Changes In Verification
By Ed Sperling - 27 Jan, 2014 - Comments: 0

Roger Hughes, director of strategic accounts at Real Intent, talks about what's changing in verification as design complexity increases and where engineers typically make mistakes. [youtube vid=0SE97LvCilo] » read more

What’s After CMOS?
By Mark LaPedus - 24 Jan, 2014 - Comments: 3

Chipmakers continue to scale the CMOS transistor to finer geometries, but the question is for how much longer. The current thinking is that the CMOS transistor could scale at least to the 3nm node in the 2021 timeframe. And then, CMOS could run out of gas, prompting the need for a new switch technology. So what’s after the CMOS-based transistor? Carbon nanotubes and graphene get the most a... » read more

Week In Review: Manufacturing, Design, Test
By Mark LaPedus - 24 Jan, 2014 - Comments: 0

Look for a nasty political campaign in Idaho, according to Bloomberg. Business leaders from Micron Technology and others in Idaho are endorsing the incumbent Republican candidate over a Tea Party challenger. The challenger, Bryan Smith, is a conservative Republican running for Idaho’s second congressional district. He is running against 16-year incumbent Mike Simpson. Simpson is supposedly pr... » read more

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