March 2014 - Page 3 of 9 - Semiconductor Engineering

We Are All Vulnerable
By Brian Bailey - 27 Mar, 2014 - Comments: 1

Target, Neiman Marcus, Michaels. We are all familiar with the huge loss of personal and financial data from these establishments. A lot more people are fuming over the data being accessed by the NSA. While we only know the details as leaked by Edward Snowden, this has to be the biggest data breach in history with the government having hacked into the data centers of Google, Yahoo and who knows ... » read more

Self-Service Semiconductors
By Mike Gianfagna - 27 Mar, 2014 - Comments: 1

The era of self-service is here. Whether you’re in a restaurant, shopping center, airport or cruising the Web, you have more options than ever to browse, research, choose and transact business with little to no human interaction. Self-service isn’t a new concept. In fact, it’s been around a long time. What is new is the pervasive use of high-tech automation to deliver experiences t... » read more

Synopsys-Coverity Deal Final
By Ed Sperling - 26 Mar, 2014 - Comments: 2

Synopsys’ acquisition of Coverity, which makes tools for testing and analyzing software, was made official yesterday. Now what? That may be the $334 million question, which is the price Synopsys paid for the 11-year-old software tools vendor. Even Synopsys’ top executives are rather candid in their uncertainty about where this deal will lead, and they made no qualms about that at the Syn... » read more

Using Virtual Prototypes To Address The Growing Software Complexity In Automotive
By Various Writers - 26 Mar, 2014 - Comments: 0

The software content is growing steadily across multiple applications and the automotive market is no exception to this. In fact the amount of electronics and software in cars is transforming the way we perceive the value of a car. With this steady increase in software also comes the need to handle the amount and the complexity of all these different software stacks. And unlike other applicatio... » read more

Vista Virtual Prototyping
By Various Writers - 26 Mar, 2014 - Comments: 0

Vista Virtual Prototyping provides an early, abstract functional model of the hardware to software engineers even before the hardware design is implemented in RTL. It can run software on embedded processor models at speeds par with board support packages, providing sufficiently fast simulation models for OS and application software validation. The Vista Virtual Prototyping solution has two dist... » read more

Blog Review: March 26
By Ed Sperling - 26 Mar, 2014 - Comments: 0

Synopsys’ Eric Huang has discovered a video of Superman using a GoPro camera (scroll down to bottom of page). So this is what it’s like to stop bullets with your hand. Cadence’s Tom Hackett zeroes in on mobile interfaces in a video—SoC fabric, memory and chip-to-chip. Nice whiteboard drawing. Mentor’s Anil Khanna looks at a methodology for developing high-performance embedded so... » read more

Power/Performance Bits: March 25
By Ann Mutschler - 25 Mar, 2014 - Comments: 0

Making flexible carbon nanotube circuits more reliable and efficient Engineers would love to create flexible electronic devices, such as e-readers that could be folded to fit into a pocket with one such approach involving designing circuits based on electronic fibers known as carbon nanotubes (CNTs) instead of rigid silicon chips -- but reliability is essential. Given that most silicon chip... » read more

System Bits: March 25
By Ann Mutschler - 25 Mar, 2014 - Comments: 0

A robot that is a toy at heart Two University of Cambridge alumnus have developed a small robot to help children learn programming and robotics while they play.   [caption id="attachment_11073" align="alignnone" width="300"] (Source: Robotiky.com)[/caption] Under the guise of Robotiky, and within two months of their initial idea, they secured seed funding for a prototype robot, w... » read more

Manufacturing Bits: March 25
By Mark LaPedus - 25 Mar, 2014 - Comments: 0

Proving the Big Bang theory A team of cosmologists using the BICEP2 telescope at the South Pole have discovered the first direct evidence of the Big Bang theory. The team includes Harvard University, the University of Minnesota, the California Institute of Technology/Jet Propulsion Laboratory, Stanford University/SLAC and others. Using the BICEP2, researchers found direct evidence of a cosm... » read more

Challenges In 3D Resists
By Katherine Derbyshire - 24 Mar, 2014 - Comments: 2

3D integration straddles the line between CMOS fabs and packaging and assembly houses. Depending on the structure being fabricated, the most appropriate process might be more “CMOS-like” or more “package-like.” For example, in CMOS fabs lithography means spin-on photoresist, exposed by a high precision stepper. Inherent in this approach is an assumption that the wafer surface is flat... » read more

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