April 2014 - Page 4 of 10 - Semiconductor Engineering

Power/Performance Bits: April 22
By Ann Mutschler - 22 Apr, 2014 - Comments: 0

Plasmonics could improve solar performance, data storage According to researchers at Purdue University, plasmonic metamaterials that operate at high temperatures could significantly improve solar cell performance and make advanced computer data storage technology possible that uses heat to record information on a magnetic disk. These materials could make it possible to harness clouds of ele... » read more

System Bits: April 22
By Ann Mutschler - 22 Apr, 2014 - Comments: 0

To mimic human cognition In the field of neuromorphic engineering, researchers study computing techniques that could someday mimic human cognition and to this end, electrical engineers at the Georgia Institute of Technology recently published a "roadmap" that details innovative analog-based techniques that could make it possible to build a practical neuromorphic computer. [caption id="attac... » read more

Cadence Gobbles Up Jasper
By Brian Bailey - 21 Apr, 2014 - Comments: 4

2012 was the year that everyone remembers Synopsys going on an acquisition binge, but 2014 will go down as the year that Cadence Design Systems decided that EDA was worth investing in. Rather than placing investment bets outside of its core competence, Cadence bought Forte in February and now adds Jasper Design Automation to its fold. Jasper started life as Tempus Fugit in 1999 and became Ja... » read more

Plugging Information Leaks
By Kenji Tsuda - 21 Apr, 2014 - Comments: 0

A former SanDisk employee was arrested on suspicion of leaking proprietary information about Toshiba’s semiconductor memory to SK Hynix. What makes this particularly interesting is SanDisk is one of Toshiba’s current business partners. The two companies have a joint venture in NAND flash, which competes with South Korea’s SK Hynix. Nihon Keizai Shimbun broke the story last month. Sugi... » read more

Architecture Of Data In The IoT
By Frank Ferro - 21 Apr, 2014 - Comments: 0

It’s clear that the Internet of Things (IoT) is no longer just a visionary concept. It’s on the verge of becoming a new reality. But this new reality is heavily dependent on the ability of an infrastructure to capture, secure and move data across networks. Given the tremendous amount of data that already surrounds us, this emerging paradigm will enable us to not just track and measure,... » read more

Executive Insight: CH Wu
By Ed Sperling - 21 Apr, 2014 - Comments: 0

Semiconductor Engineering sat down with CH Wu, president and CEO of Advantest Taiwan, to talk about business, politics, and his philosophy on what really motivates people. What follows are excerpts of that conversation. SE: Tell us a little about who you are and your background. Wu: I graduated from college with a degree in electrical engineering and started at Philips Electric, then moved ... » read more

The Week In Review: Design
By Ed Sperling - 18 Apr, 2014 - Comments: 0

Certifications TSMC certified Mentor Graphics’ DFM, place and route and custom IC tools, as well as its SPICE simulator, for the 16nm finFET process.  The foundry also certified Cadence’s digital and custom/analog tools for that process, including physical verification, QRC extraction, timing sign off and its power integrity solution. And it certified Synopsys’ digital and custom soluti... » read more

Improving Yield Of 2.5D Designs
By Ann Mutschler - 18 Apr, 2014 - Comments: 0

While progress is being made on the packaging side of 2.5D design, more needs to be resolved when it comes to improving yields. Proponents of 2.5D present compelling benefits. Arif Rahman, a product architect at Altera, noted that the industry trend of silicon convergence is leading to multiple technologies being integrated into single-chip solutions. “2.5D/3D integration has multiple adva... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 18 Apr, 2014 - Comments: 0

There is more evidence of a fab tool slowdown. In fact, ASML itself sounded the alarm during its earnings conference call this week. “ASML noted uncertainty regarding the timing of both the 16/14 nm finFET ramp at foundries (the company is seeing a delay from customers as the technology is still in development, in our view) and 3D NAND,” said Weston Twigg, an analyst from Pacific Crest Secu... » read more

Mask Issues Ahead
By eBeam Initiative - 17 Apr, 2014 - Comments: 0

It's not just the lithography that's getting complicated. Check out this video by Dai Nippon Printing's Naoya Hayashi. [youtube vid=a6WmvhTdEv4] » read more

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