December 2015 - Page 4 of 10 - Semiconductor Engineering


Scaling Automated Software Testing With Virtualizer Development Kits


In this whitepaper we will discuss how simulation-based Virtualizer Development Kits (VDKs) enable software to be tested in a system context much earlier, bridging the gap with unit and integration testing. Moreover, we will discuss how VDKs offer a more scalable solution as they consist of simulation models and hence alleviate the dependency on hardware labs. To read more, click here. » read more

C-Based SoC Design Flow And EDA Tools


This paper examines the achievements and future of SoC design methodology and design flow from the viewpoints of an in- house EDA team of an ASIC and system vendor. We initially discuss the problems of the design productivity gap caused by the SoC’s complexity and the timing closure caused by deep submicron technology. To solve these two problems, we propose a C-based SoC design environment t... » read more

Who’s Profiting From Complexity


Tool vendors' profits increasingly are coming from segments that performed relatively poorly in the past, reflecting both a rise in complexity in designing chips and big improvements in the tools themselves. The impacts of power, memory congestion, advanced-node effects such as process variation, [getkc id="160" kc_name="electromigration"] and RC delay in [getkc id="36" kc_name="interconnect... » read more

Inside Inspection And Metrology


Semiconductor Engineering sat down to talk about inspection, metrology and other issues with Mehdi Vaez-Iravani, vice president of advanced imaging technologies at Applied Materials. What follows are excerpts of that conversation. SE: Today, the industry is working on a new range of complex architectures, such as 3D NAND and finFETs. For these technologies, the industry is clearly struggling... » read more

The Week In Review: Manufacturing


Samsung plans to make a major entry into the drone market, according to reports. “Samsung is not alone in focusing on the drone market,” said Will Strauss, president of Forward Concepts, in a research note. “At CES next month in Las Vegas, one can expect new products from drone market leader DJI, but dozens of new drone models from Parrot and many other companies. Even GoPro chip maker A... » read more

The Week In Review: Design/IoT


Tools, IP, & IoT Mentor Graphics updated its general purpose computational fluid dynamics product, adding improved mesh handling, an enhanced transient solver, a robust EDA interface, and an interface to Abaqus Finite Element Analysis (FEA) software for stress analysis. Arasan uncorked MIPI DSI v1.3 controller IP with support for Display Stream Compression, Sub links, Deskew, and Chec... » read more

Mobile Market Dynamics Are Changing


Ever since the introduction of the iPhone in June 2007, increasingly advanced SoCs have dominated the semiconductor supply chain, from tools to design houses to foundries. Android's introduction in 2010 only cemented the market. Together they created massive demand for power-efficient chips that were dark most of the time, feature-rich, and which could respond within milliseconds to any command... » read more

China’s Demand Slowdown


It is well known that China is the largest consumer of semiconductors on a regional basis, and as China’s economic growth slows, it is interesting to take a look at where they have the most impact from a product perspective. There are a few surprises. Although the overall semiconductor average selling price in China is a fraction of the total worldwide ASP, China does not always have the lowe... » read more

Fab Tool Biz Looks Cloudy


Amid a slowdown in the foundry and DRAM sectors, the outlook for the semiconductor equipment industry looks somewhat cloudy, if not challenging, in 2016. In fact, for equipment vendors, 2016 could resemble the lackluster year in 2015. In 2015, for example, capital spending in the foundry sector fell during the year, although NAND flash began to pick up steam. In 2015, though, the big stor... » read more

Rise Of The Old Fab


Growth in the [getkc id="260" comment="Internet of Everything"], along with the beginning of a shift toward systems in package, are creating buzz in a rather unlikely place—established and well-worn process nodes where equipment is scarce, semi-functional, and difficult to maintain. In the past, moving to the next node was a sign of progress, leaving behind the trailing edge of designs to ... » read more

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