October 2016 - Page 4 of 12 - Semiconductor Engineering


System Bits: Oct. 25


Scalable quantum computers In what they say is a significant step towards to the realization of a scalable quantum computer, researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits. The quantum socket is a wiring method that uses 3D based on spring-lo... » read more

Watch Out For 200mm Fabs: Fab Outlook To 2020


One year after the debut of the industry’s first 200mm Fab Outlook report, SEMI has just issued an October 2016 update with the improved and expanded report forecasting 200mm fab trends out to 2020. This extensive report features trends from 2009 to 2020, showing how 200mm fab activities and capacity change worldwide.  Industry spending for construction and equipment is detailed and analy... » read more

GaN Power Semi Biz Heats Up


The market for devices based on gallium nitride (GaN) technology is heating up amid the push for faster and more power efficient systems. Today, [getkc id="217" kc_name="GaN"] is widely used in the production of LEDs. In addition, it is gaining steam in the radio-frequency (RF) market. And the GaN-based power semiconductor market finally appears ready to take off, after several false starts ... » read more

IP Market: CPU Still The Largest But Security Leads In Growth


The 3rd Party Semiconductor Intellectual Property (SIP) market has seen great innovation in the products it offers to System-on-a-Chip (SoC) designers over the last ten years. If any market segment in the semiconductor industry typifies the intense evolutionary pressures that the entire electronics market has undergone, it is the 3rd Party SIP market. Most of these evolutionary forces are dr... » read more

The Week In Review: Manufacturing


Chipmakers At upcoming the 2016 IEEE International Electron Devices Meeting (IEDM) in San Francisco, TSMC will square off against the alliance of IBM, GlobalFoundries and Samsung at 7nm. IEDM will take place Dec. 3-7, 2016. TSMC will present a paper on 7nm finFET technology. Using 193nm immersion and multi-patterning, the 7nm technology features more than three times the gate density and ei... » read more

The Week In Review: IoT


Security The Defense Advanced Research Projects Agency (DARPA) in August held the finals of its Cyber Grand Challenge, a competition that came down to seven teams in Las Vegas, with the three winning teams sharing cash prizes totaling $3.75 million. The capture-the-flag style contest let cybersecurity software counter various attacks on its own, without the aid of engineers and programmers. Th... » read more

The Week In Review: Design


Tools Mentor Graphics added RF verification capabilities for wireless applications in the connected sensor and IoT markets to its Tanner design and layout suite. Mentor also integrated its Questa verification tool with the open-source Jenkins Continuous Integration and Source Code Management (CI/SCM) ecosystem. The plugin, a free download, gives Jenkins the ability to utilize regression run ... » read more

How Many Nanometers?


What’s the difference between a 10nm and a 7nm chip? That should be a straightforward question. Math, after all, is the only pure science. But as it turns out, the answer is hardly science—even if it is all about numbers. Put in perspective, at 65nm, companies defined the process node by the half pitch of the first metal layer. At 40/45nm, with the cost and difficulty of developing n... » read more

To 10nm And Beyond


Hong Hao, senior vice president of the foundry business at Samsung Semiconductor, sat down with Semiconductor Engineering to discuss the future direction of transistors, process technology, lithography and other topics. What follows are excerpts of those conversations. SE: Samsung recently rolled out its 10nm finFET technology. It appears that Samsung is the world’s first company to ship 1... » read more

Achieving The Vision Of Silicon Photonics Processing


With the increasing need for faster data transfer rates, the transition from electrical to optical signaling in data processing is inevitable. Copper cabling cannot keep up with the upcoming data center bandwidth requirements for applications such as multimedia streaming and high performance computing. One technology that could enable true optical communication is silicon photonics. Silicon is ... » read more

← Older posts Newer posts →