March 2017 - Page 4 of 11 - Semiconductor Engineering

Rapid SoC Proof-Of-Concept For Zero Cost
By Mentor, a Siemens Business - 22 Mar, 2017 - Comments: 0

A new breed of designers has arrived that is leveraging inexpensive sensors to build the intelligent systems at the edge of the Internet of Things (IoT). They work in small teams, collaborate online, and they expect affordable design tools that are easy to use in order to quickly produce results. Their goal is to deliver a functioning device to their stakeholders while spending as little money ... » read more

Data Leakage And The IIoT
By Ed Sperling - 22 Mar, 2017 - Comments: 1

The Internet of Things has raised concerns about people hacking into home networks or using armies of bots to disrupt communications. But with the Industrial IoT, the stakes are significantly higher—and the effects can last much longer. Security tops the list of concerns as more industrial equipment is connected to the Internet, according to numerous industry insiders. That hasn't stopped ... » read more

Blog Review: March 22
By Jesse Allen - 22 Mar, 2017 - Comments: 0

Cadence's Paul McLellan shares TSMC's plans for 5nm and gate-all-around FET, plus other highlights from last week's Technology Symposium. Mentor's Craig Armenti examines how product development teams can increase efficiency through concurrent schematic design. Synopsys' Jim Ivers warns of the data security and privacy issues posed by a wave of popular connected toys. At Embedded World,... » read more

Manufacturing Bits: March 21
By Mark LaPedus - 21 Mar, 2017 - Comments: 0

Making harder windows Using cubic silicon nitride materials, a team of researchers have developed a harder window that can sustain severe conditions. There is a demand for harder and stronger windows in various applications, such as engines, ball bearings, cutting tools and other others. To enable this technology, researchers used materials based on transparent polycrystalline ceramics. One... » read more

System Bits: March 21
By Ann Mutschler - 21 Mar, 2017 - Comments: 0

Sensors vulnerable to sonic cyber attacks According to University of Michigan researchers, sound waves could be used to hack into critical sensors in a wide range of technologies including smartphones, automobiles, medical devices and IoT devices. New research calls into question the longstanding computer science tenet that software can automatically trust hardware sensors, which feed auton... » read more

Power/Performance Bits: March 21
By Jesse Allen - 21 Mar, 2017 - Comments: 0

Tiny redox flow batteries for chips Researchers at ETH Zurich and IBM Research Zurich built a tiny redox flow battery capable of both powering and cooling stacks of chips. In a flow battery, an electrochemical reaction is used to produce electricity out of two liquid electrolytes, which are pumped to the battery cell from outside via a closed electrolyte loop. Such batteries are usually u... » read more

Patterning Problems Pile Up
By Mark LaPedus - 20 Mar, 2017 - Comments: 4

Chipmakers are ramping up 16nm/14nm finFET processes, with 10nm and 7nm now moving into early production. But at 10nm and beyond, chipmakers are running into a new set of problems. While shrinking feature sizes of a device down to 10nm, 7nm, 5nm and perhaps beyond is possible using current and future fab equipment, there doesn't seem to be a simple way to solve the edge placement error (EPE)... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 17 Mar, 2017 - Comments: 0

Chipmakers At this week’s TSMC Technology Symposium in San Jose, Calif., TSMC rolled out a dizzying array of new processes and technologies. Perhaps the most surprising announcement was a 22nm bulk CMOS process, which is geared for ultra low-power planar chips. The technology will compete against a 22nm FD-SOI technology from GlobalFoundries. Stay tuned. The battle has just begun. As e... » read more

The Week In Review: Design
By Jesse Allen - 17 Mar, 2017 - Comments: 0

Business Andes Technology went public this week on the Taiwan Stock Exchange with an initial stock listing of 40,611,915 shares at a price of NT$65.10 (USD $2.12) per share. The shares began trading March 14, 2017, under the TWSE ticker symbol “6533.TWO.” Andes plans to use the proceeds to expand the company's R&D effort, to fuel international expansion into the U.S. and Europe and t... » read more

The Week In Review: IoT
By Jeff Dorsch - 17 Mar, 2017 - Comments: 0

Government Maureen Ohlhausen, the acting head of the Federal Trade Commission, said in an interview that she looks to manufacturers of Internet-connected devices to decide on best practices for the Internet of Things. Although the FTC has the legal authority to set regulations for a variety of industries, Ohlhausen said the commission is “not primarily a regulator,” in line with the new ad... » read more

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