March 2018 - Page 2 of 13 - Semiconductor Engineering


Manufacturing Bits: March 27


Nanostructure printers Using electron-beam lithography and reactive-ion etching techniques, Singapore’s Agency for Science, Technology and Research (A*STAR) has developed a new high-resolution color nanostructure printing system. The printer enables nanostructures made from silicon. It prints tiny structures with a wide range of colors. In the future, researchers hope that nanostructure ... » read more

System Bits: March 27


New quantum electronic material has atomic structure resembling a Japanese basketweaving pattern According to MIT, Harvard University, and Lawrence Berkeley National Laboratory researchers, a motif of Japanese basketweaving known as the kagome pattern has preoccupied physicists for decades. They reminded that kagome baskets are typically made from strips of bamboo woven into a highly symmetric... » read more

Looking For The Elephant In The Valley


As a new arrival in the Silicon Valley and a woman, my head is full of statistics and charts. Not the kind that data scientists use to power their decision-making, but the kind that has made its way into the public discourse more and more in the last few years—diversity numbers in the tech industry. Armed with this data, I set out to talk to my company’s female CEO, Sundari Mitra, as wel... » read more

Power/Performance Bits: March 27


Equalizing batteries Engineers at the University of Toledo propose a bilevel equalizer technology to improve the life span of batteries by combining the high performance of an active equalizer with the low cost of a passive equalizer. "Whenever we are talking about batteries, we are talking about cells connected in a series. Over time, the battery is not balanced and limited by the weakest ... » read more

Abstracting Abstracter Abstractions In Functional Verification


I heard a clear three-part message during DVCon at the end of February: verification engineers must abstractly embrace the abstract idea of abstracting abstract abstraction through higher levels of abstraction; we overuse the word abstract to emphasize the value of whatever verification technique we happen to be talking about; and the key to new abstractions is using Portable Stimulu... » read more

When AI Goes Awry


The race is on to develop intelligent systems that can drive cars, diagnose and treat complex medical conditions, and even train other machines. The problem is that no one is quite sure how to diagnose latent or less-obvious flaws in these systems—or better yet, to prevent them from occurring in the first place. While machines can do some things very well, it's still up to humans to devise... » read more

The Week In Review: Manufacturing


Trade President Trump this week announced his decisions on the actions the administration will take in response to China’s alleged unfair trade practices covered in the USTR Section 301 investigation of “China’s Acts, Policies, and Practices Related to Technology Transfer, Intellectual Property, and Innovation.” Trump has proposed import tariffs that amount to about $60 billion on pro... » read more

The Week in Review: IoT


Finance Bestmile, which offers a mobility platform for managing autonomous vehicle fleets, raised $11 million in Series A funding led by Road Ventures SA. Also participating in the round are Partech Ventures, Groupe ADP, Airbus Ventures, Serena Capital, and MobilityFund. The startup, incorporated in 2014, will use the money for worldwide expansion, strengthening its cloud-based mobility platfo... » read more

The Week In Review: Design


M&A Synopsys acquired Silicon and Beyond, a provider of high-speed SerDes and ADC/DAC IP. The company was founded in 2012 as SilabTech and headquartered in Bangalore. Synopsys highlighted the team of R&D engineers with high-speed SerDes expertise that would be joining with the acquisition. Terms of the deal were not disclosed. ANSYS will acquire OPTIS, a provider of software for sci... » read more

Smaller, Faster, Cheaper—But Different


The old mantra of "smaller, faster, cheaper" has migrated from the chip level to the electronic system level, raising some interesting questions about where the real value is being generated. Smaller as it pertains to gate size, line widths and spaces, will continue in an almost straight line for at least the next decade. The ability to print three-dimensional features on a nanoscale using E... » read more

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