January 2019 - Page 3 of 13 - Semiconductor Engineering

Power/Performance Bits: Jan. 29
By Jesse Allen - 29 Jan, 2019 - Comments: 0

Neural nets struggle with shape Cognitive psychologists at the University of California Los Angeles investigated how deep convolutional neural networks identify objects and found a big difference between the way these networks and humans perceive objects. In the first of a series of experiments, the researchers showed color images of animals and objects that had been altered to have a diffe... » read more

China’s Foundry Biz Takes Big Leap Forward
By Mark LaPedus - 28 Jan, 2019 - Comments: 1

China continues to advance its foundry industry with huge investments in new fabs and technology, despite trade tensions and a slowdown in the IC market. China has the most fab projects in the world, with 30 new facilities or lines in construction or on the drawing board, according to data from SEMI’s World Fab Forecast Report. Of those, 13 fabs are targeted for the foundry market, accordi... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 25 Jan, 2019 - Comments: 0

Chipmakers Shares of Intel fell amid lackluster results for the company, according to a report from CNBC. But Intel is also boosting its capital spending to $15.5 billion, according to the report. Here’s more on Intel from PC World. Meanwhile, Intel is expanding its research fab in Oregon, dubbed D1X, according to a report from The Oregonian. The company is in the process of building an ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 25 Jan, 2019 - Comments: 0

M&A Ansys will acquire Helic, a provider of electromagnetic crosstalk analysis and signoff tools. Founded in 2000, Helic's tools included pre- and post-LVS EM modeling, inductor synthesis and modeling, and analysis of crosstalk risk. The company's technology will be integrated into a solution for on-chip, 3D integrated circuit and chip-package-system electromagnetics and noise analysis. Th... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 25 Jan, 2019 - Comments: 0

Internet of Things Tony Franklin, Intel’s general manager for Internet of Things Segments, is interviewed by Lorin Fries on how the chipmaker is helping to develop smart farming applications. “We focus primarily on high-performance computer technologies, as well as communication technologies, which have great applicability for food systems. We work closely with a broad ecosystem of partner... » read more

Variation’s Long Tentacles
By Ed Sperling - 24 Jan, 2019 - Comments: 1

Today, most design engineers don't pay much attention to variation. It's generally considered to be a manufacturing problem. Even within the fab, various job functions are segmented enough that variation in one part of the process, such as the photomask shop, doesn't necessarily come to the attention of the people doing deposition and etch or those polishing the wafers. But increasingly, ... » read more

Variation Issues Grow Wider And Deeper
By Ed Sperling - 24 Jan, 2019 - Comments: 0

Variation is becoming more problematic as chips become increasingly heterogeneous and as they are used in new applications and different locations, sparking concerns about how to solve these issues and what the full impact will be. In the past, variation in semiconductors was considered a foundry issue, typically at the most advanced process node, and largely ignored by most companies. New p... » read more

Fearless chip and fab tool forecasts
By Mark LaPedus - 24 Jan, 2019 - Comments: 1

2019 is expected to be a challenging, if not confusing, year for the semiconductor and fab equipment industries. For example, Apple recently issued a warning about lackluster smartphone demand, which impacted several IC vendors and foundries. Then, the memory market is plummeting. In addition, the 10nm/7nm transition has proven to be difficult for many. And let’s not forget the geopolitica... » read more

Embedded Phase-Change Memory Emerges
By Mark LaPedus - 24 Jan, 2019 - Comments: 3

The next-generation memory market for embedded applications is becoming more crowded as another technology emerges in the arena—embedded phase-change memory. Phase-change memory is not new and has been in the works for decades. But the technology has taken longer to commercialize amid a number of technical and cost challenges. Phase-change memory, a nonvolatile memory type that stores data... » read more

Analyzing Worst-Case Silicon Photonic Device Performance Through Process Modeling And Optical Simulation
By Ryan Miller - 24 Jan, 2019 - Comments: 0

Silicon photonics is an emerging and rapidly-expanding design platform that promises to enable higher-bandwidth communication and other applications. One of the best qualities of silicon photonics is its ability to leverage existing CMOS fabrication equipment and process flows. However, this means that it is subject to the same process defects and variations. Previous blog posts [References 1,2... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy