February 2019 - Page 3 of 12 - Semiconductor Engineering

The Good And Bad Of 2D Materials
By Katherine Derbyshire - 27 Feb, 2019 - Comments: 0

Despite years of warnings about reaching the limits of silicon, particularly at leading-edge process nodes where electron mobility is limited, there still is no obvious replacement. Silicon’s decades-long dominance of the integrated circuit industry is only partly due to the material’s electronic properties. Germanium, gallium arsenide, and many other semiconductors offer superior mobili... » read more

DO-254 Requirements Traceability
By Aldec - 27 Feb, 2019 - Comments: 0

DO-254 enforces a strict requirements-driven process for the development of commercial airborne electronic hardware. For DO-254, requirements must drive the design and verification activities, and requirements traceability helps to ensure this. This paper explains the rationale behind requirements traceability including its purpose and resulting benefits when done correctly. Click here to re... » read more

Blog Review: Feb. 27
By Jesse Allen - 27 Feb, 2019 - Comments: 0

Mentor's Harry Foster checks out the trends in language and library adoption for IC/ASIC designs and finds increased adoption of SystemVerilog for both design and verification while UVM remains the dominant verification methodology. Synopsys' Taylor Armerding chats with Chris Clark of Synopsys and Tim Weisenberger of SAE about the weakest points in automotive security and why it's time to mo... » read more

Manufacturing Bits: Feb. 26
By Mark LaPedus - 26 Feb, 2019 - Comments: 0

Vitamin C chips Using vitamin C, Rice University has developed a process that turns gold nanorods into small gold nanowires. Nanorods are a type of structure, while nanowires are simply tiny wires. With the technology, Rice is able to produce nanowires with various lengths. These can be used in electronics as well as light-manipulating applications like plasmons. A “plasmon is a quantum o... » read more

System Bits: Feb. 26
By Jeff Dorsch - 26 Feb, 2019 - Comments: 0

Firefly microstructures in LED light bulbs Pennsylvania State University researchers wanted to improve the energy efficiency of commercial light-emitting diode light bulbs to save even more energy. They found the answer in the lantern surface of fireflies. "LED lightbulbs play a key role in clean energy," said Stuart (Shizhuo) Yin, professor of electrical engineering at Penn State. "Overall... » read more

Power/Performance Bits: Feb. 26
By Jesse Allen - 26 Feb, 2019 - Comments: 0

Integrated RRAM for edge AI Researchers at CEA-Leti and Stanford University have developed the first circuit integrating multiple-bit non-volatile Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM. The proof-of-concept chip monolithically integrates two heterogeneous technologies: 18KB of on-chip... » read more

Engineering Talent Shortage Now Top Risk Factor
By Mark LaPedus - 25 Feb, 2019 - Comments: 16

Demand is increasing for engineers and related technical fields in the IC industry, but companies are struggling to find enough talent. The problem is even worse in hot new markets such as AI and 5G, where competition is fierce for experienced workers. The talent shortfall starts with college graduates and professionals in the fields of science, technology, engineering and mathematics (STEM)... » read more

Self-Driving Architecture With eFPGAs
By Alok Sanghavi - 25 Feb, 2019 - Comments: 0

The favored self-driving architecture of the future will be increasingly decentralized. However, both the centralized and decentralized architectural design approaches will require hardware acceleration in the form of far more lookaside co-processing than is currently realized. Whether centralized or decentralized, the anticipated computing architectures for automated and autonomous driving ... » read more

Partitioning Drives Architectural Considerations
By Ann Mutschler - 25 Feb, 2019 - Comments: 0

Semiconductor Engineering sat down to explore partitioning with Raymond Nijssen, vice president of system engineering at Achronix; Andy Ladd, CEO at Baum; Dave Kelf, chief marketing officer at Breker; Rod Metcalfe, product management group director in the Digital & Signoff Group at Cadence; Mark Olen, product marketing group manager at Mentor, a Siemens Business; Tom Anderson, technical mar... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 Feb, 2019 - Comments: 0

Chipmakers IC Insights has released the process technology roadmaps for chipmakers and foundries. GlobalFoundries, Intel, Samsung, SMIC, TSMC and UMC are highlighted. GlobalFoundries has announced that the company’s 8SW RF SOI technology has delivered more than a $1 billion of client design win revenue since its launch in 2017. RF SOI is designed for RF switches and other devices in 4G/... » read more

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