Just how real is 3D stacking and what are the main hurdles that need to be solved.
Semiconductor Manufacturing & Design examines the myth and reality of 3D stacking–and the hurdles that still need to be solved. In the hot seat: VC Jim Hogan; eSilicon’s Prasad Subramanian; Sonics’ Drew Wingard; Atrenta’s Mike Gianfagna, and Mentor Graphics’ Michael White.
30 facilities planned, including 10/7nm processes, but trade war and economic factors could slow progress.
Applied Materials’ VP looks at what’s next for semiconductor manufacturing and the impact of variation, new materials and different architectures.
Researchers digging into ways around the von Neumann bottleneck.
iPhone X elevates niche optical technology to hot growth market. Now the question is what else it is good for?
Optimizing complex chips requires decisions about overall system architecture, and memory is a key variable.
Semiconductor devices face many hazards before and after manufacturing that can cause them to fail prematurely.
Chips will cost more to design and manufacture even without pushing to the latest node, but that’s not the whole story.
This will go down as a good year for the semiconductor industry, where new markets and innovation were both necessary and rewarded.
Experts at the Table, Part 1: Impact on the supply chain, who’s using advanced packaging, and the cost of packaging versus device scaling.
Companies battle it out to get artificial intelligence to the edge using various chip architectures as their weapons of choice.
Technology adds more granularity, but starting point for design shifts as architectures cope with greater volumes of data.
Bulk CMOS, FD-SOI and finFETs all on tap as big players vie for differentiation. But where will chipmakers go after 28nm?
30 facilities planned, including 10/7nm processes, but trade war and economic factors could slow progress.
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