Just how real is 3D stacking and what are the main hurdles that need to be solved.
Semiconductor Manufacturing & Design examines the myth and reality of 3D stacking–and the hurdles that still need to be solved. In the hot seat: VC Jim Hogan; eSilicon’s Prasad Subramanian; Sonics’ Drew Wingard; Atrenta’s Mike Gianfagna, and Mentor Graphics’ Michael White.
Lines blur as processors are added into traditional FPGAs, and programmability is added into ASICs.
Costs of developing a complex chip could run as high as $1.5B, while power/performance benefits are likely to decrease.
Experts at the Table, part 1: Why machine learning works in some cases and not in others.
Technology has the potential to reshape processing everywhere, starting with limited scientific and commercial applications.
Continued integration is no longer the natural way forward for semiconductors. What needs to happen to make it easier?
Why packaging is becoming increasingly critical and difficult in the automotive market.
Lines blur as processors are added into traditional FPGAs, and programmability is added into ASICs.
Costs of developing a complex chip could run as high as $1.5B, while power/performance benefits are likely to decrease.
Flexible hybrid electronics are showing up in a variety of markets where electronics never existed before.
Total private funding was more than $1.35B in 2H 2017, but investors also are showing more caution about where they put their money.
Shortages of used equipment and lower margins mean this problem isn’t getting solved anytime soon.
Random variations will require new methodologies, tools and cooperation among different companies.
Most attacks in the past focused on gaining access to software, but Meltdown and Spectre have changed that forever.
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