Just how real is 3D stacking and what are the main hurdles that need to be solved.
Semiconductor Manufacturing & Design examines the myth and reality of 3D stacking–and the hurdles that still need to be solved. In the hot seat: VC Jim Hogan; eSilicon’s Prasad Subramanian; Sonics’ Drew Wingard; Atrenta’s Mike Gianfagna, and Mentor Graphics’ Michael White.
AI-enabled systems are being designed to process more data locally as device scaling benefits decline.
Foundry forms ASIC subsidiary as it focuses on 14nm/12nm and above.
Growing volume of data and limited improvements in performance create new opportunities for approaches that never got off the ground.
Old solutions don’t necessarily work anymore, particularly at advanced nodes and ultra-low voltage.
Company’s push into deep learning opens door to a variety of new architectures, including tiles, advanced packaging and more customized solutions.
Costs of developing a complex chip could run as high as $1.5B, while power/performance benefits are likely to decrease.
AI-enabled systems are being designed to process more data locally as device scaling benefits decline.
Lines blur as processors are added into traditional FPGAs, and programmability is added into ASICs.
Foundry forms ASIC subsidiary as it focuses on 14nm/12nm and above.
Technology has the potential to reshape processing everywhere, starting with limited scientific and commercial applications.
Market overcrowding, more efficient manufacturing, and growing list of scaling issues create a challenging competitive landscape.
Using the Von Neumann architecture for artificial intelligence applications is inefficient. What will replace it?
Experts at the Table, part 1: Why machine learning works in some cases and not in others.
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