3D Stacking: Reality Check

Next nodes are expected to be long-lasting, because costs of developing chip after that will skyrocket.

Mark Bohr opens up on the company’s push into multi-chip solutions, and upcoming issues at 7nm and 5nm.

Technical issues increase, costs go up, and not all markets will benefit.

Proponents tout freedom for computing architectures, but is the semiconductor ecosystem ready for open-source hardware?

Chipmakers wrestle with EOS, ESD and other power-related issues as leading-edge chips are incorporated into industrial and automotive applications.

Advanced packaging shifts to mainstream with complete flows, better tools, market proof points.

High price of moving to finFETs pushes foundries to offer a less expensive alternative.

Foundry unit rolls out ambitious plan down to 4nm, along with 18nm FD-SOI and advanced packaging developments.