3D Stacking: Reality Check

Technical issues increase, costs go up, and not all markets will benefit.

Chipmakers wrestle with EOS, ESD and other power-related issues as leading-edge chips are incorporated into industrial and automotive applications.

There are multiple layers in which machine learning can help with the creation of semiconductors, but getting there is not as simple as for other application areas.

Next-gen embedded memory technology ramps up in wake of flash scaling issues.

Chipmakers exploring nanosheet, nanoslab, nano-ring and hexagonal FETs.

Funding is free-flowing for the field, but hurdles persist.

Demand for equipment soars, but not all business models can support rising prices.

Focus is on cutting costs across the board, and it turns out there is still quite a bit to cut.