Heterogenous Integration Expertise for Sensors and MEMS Packaging and Assembly
The packaging and assembly challenges posed by increasingly complex sensors and MEMS.
Sensors and microelectromechanical systems (MEMS) are unlocking new design possibilities for miniature devices used in healthcare, smart systems, consumer electronics, and more. Designers need a partner experienced with Heterogenous Integration (HI) to assemble the unique components for these devices and address the complications of these integrations.
In this white paper, you will learn:
- The packaging and assembly challenges posed by increasingly complex sensors and MEMS
- How heterogenous integration (HI) provides innovative assembly solutions, especially for advanced medical devices
- How designers use HI sensors to add unique components to devices while having to resolve new manufacturing and assembly issues
- How Promex’s Phase Gate process can take your sensors and MEMS projects from design to full production
- Examples of Lab-on-a-Chip devices that Promex developed using HI at the instrument and cartridge levels
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