Optimize application security tools with interactive application security testing.
As the pace, volume, and complexity of application development continue to escalate, it becomes increasingly difficult to maintain software security and quality. More speed, more volume, and more complexity too often lead to less security and less quality.
Interactive application security testing (IAST) is an exciting option for organizations looking to maintain both the speed and complexity of their development and the quality and security of their applications.
This paper examines how IAST can be used in conjunction with other application security tools, where it can replace tools, and how its strengths are uniquely beneficial to development workflows and processes.
Backed by Forrester research data, this paper is a must-read for development and security leaders looking to optimize their application security tools.
Click here to read more.
Disaggregation and the wind-down of Moore’s Law have changed everything.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Continued expansion in new and existing markets points to massive and sustained growth.
Aging equipment and rising demand are pushing up prices and slowing production.
Experts at the Table: Designing for context, and geopolitical impacts on a global supply chain.
Interest in this particular ISA is expanding, but the growth of other open-source hardware is less certain.
Nanosheets are likeliest option throughout this decade, with CFETs and other exotic structures possible after that.
Hybrid bonding opens up whole new level of performance in packaging, but it’s not the only improvement.
Why this is becoming a bigger issue, and what can be done to mitigate the effects.
Some 300mm tools are converted to 200mm; equipment prices and chip manufacturing costs are rising.
From low resistance vias to buried power rails, it takes multiple strategies to usher in 2nm chips.
Manufacturing 3D structures will require atomic-level control of what’s removed and what stays on a wafer.
Disaggregation and the wind-down of Moore’s Law have changed everything.
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