Author's Latest Posts

6 Steps To Successful Board Level Reliability Testing
By Ansys - 07 Apr, 2021 - Comments: 0

For semiconductor manufacturers entering the automotive environment, the lack of universal qualifications standards often leads to inconsistent reliability expectations. The most efficient solution is to establish a robust and thorough BLR testing plan that is uniquely designed for a specific manufacturer validated by a broad range of industry experiences. 6 Steps to Successful Board Level R... » read more

Analysis And Development of Safety-Critical Embedded Systems
By Ansys - 13 Feb, 2021 - Comments: 0

Today’s automobiles and airplanes feature more electronic components than ever. Hundreds of connected systems enable safety-critical functions like braking, acceleration, steering, navigation and communication. Ansys has the only comprehensive simulation solution for designing safe, reliable systems — including hardware, electronics and embedded software — for human-controlled and autonom... » read more

Realize A More Productive EDA Environment From HPE With AMD
By Ansys - 13 Jan, 2021 - Comments: 0

Few industries are more competitive than modern electronics manufacturing and chip design. Consumers expect devices to be faster, cheaper, and more reliable with each generation. Whether large or small, electronics manufacturers rely on electronic design automation (EDA) to enable these improvements. Click here to access the white paper. » read more

HPC Appliance Boosts Simulation Performance
By Ansys - 09 Dec, 2020 - Comments: 0

High-performance computing (HPC) resources can provide a substantial boost to simulation, but an HPC cluster can be complex and difficult to manage. By deploying a managed HPC cluster for ARA, the client was able to eliminate internal maintenance and support overhead, while improving productivity and reliability for their Ansys workloads. Click here to read more. » read more

Chip-Package Co-Analysis Using Ansys RedHawk-CPA
By Ansys - 11 Nov, 2020 - Comments: 0

Ansys RedHawk-CPA is an integrated chip–package co-analysis solution that enables quick and accurate modeling of the package layout for inclusion in on-chip power integrity simulations using Ansys RedHawk. With RedHawk-CPA a designer can perform static IR drop analysis and AC hotspot analysis of the package layout following RedHawk static and dynamic analyses respectively. To ensure a reliab... » read more

Maximizing Ansys LS-DYNA Performance With AMD EPYC 7Fx2 Processors
By Ansys - 14 Oct, 2020 - Comments: 0

AMD EPYC 7Fx2 processors bring high frequencies and very highs ratios of cache per core to the 2nd Gen EPYC family of processors. EPYC 7Fx2 processors build on the large memory capacity, extreme memory bandwidth and massive I/O of the 2nd Gen EPYC family to deliver exceptional HPC workload performance. This paper describes the excellent performance of these chips in running Ansys LS-DYNA comput... » read more

Electro-Thermal Signoff For Next Gen 3DICs
By Ansys - 09 Sep, 2020 - Comments: 0

Multi-die designs, 2.5D and 3D, have been rising in popularity as they offer tremendously increased levels of integration, a smaller footprint, performance gains and more. While they are attractive for many applications, they also create design bottlenecks in the areas of thermal management and power delivery. For 3DICs, in addition to the complex SoC/PCB interactions seen in their 2D counterpa... » read more

Run Simulations at Top Speed
By Ansys - 12 Aug, 2020 - Comments: 0

The Ansys Fluent solver can be so computationally demanding that complex simulations can take hours to complete. Ansys and Intel worked together to build a new smoother and optimize it for Intel Xeon Scalable processors to help reduce those long simulation times. This whitepaper reviews the results of performance testing conducted with Ansys Fluent 2020 R1 when making use of the Intel MKL sp... » read more

Multiphysics Reliability Signoff For Next-Generation Automotive Electronics Systems
By Ansys - 08 Jul, 2020 - Comments: 0

Automotive electronics systems depend on an ever-increasing number of electronic sensors and processing elements, which allow for 360-degree surveillance and object identification/classification. Designing and verifying these systems is, however, as complex as the systems themselves. This white paper examines how automotive chip designers can achieve the stringent safety and reliability requ... » read more

How To Design User Equipment Antenna Systems For 5G Wireless Networks
By Ansys - 10 Jun, 2020 - Comments: 0

Next-generation cellular wireless communications will enable numerous innovative, cutting-edge technologies and products. The combination of millimeter-wave (mm-wave) and microwave bands accompanied by advanced spatial multiplexing techniques such as massive multiple-input multiple-output (MIMO) will form the backbone of a new cellular technology called 5G. The evolution to 5G promises low late... » read more

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