Author's Latest Posts

When Failure Is Not An Option: Improving Medical Device Reliability
By Ansys - 07 Jul, 2021 - Comments: 0

Medical electronics are expected to operate safely over extended periods of time to provide monitoring, therapeutic or life-sustaining functions for patients. Without built-in reliability, these devices could experience failures or malfunctions that greatly increase the possibility of infection or death. In the movie Apollo 13, NASA’s Gene Kranz (played by actor Ed Harris) made the phrase “... » read more

How To Build A Virtual Electromagnetic Test Environment For Aerospace And Automotive Platforms
By Ansys - 09 Jun, 2021 - Comments: 0

To protect the electromagnetic compatibility (EMC) of complex systems like aircraft and automobiles, you need a full electromagnetic (EM) model. A virtual test environment allows you to assess a design and ensure system-level compatibility before physical testing. This process has been proven to save more than $1 million compared to an approach based solely on testing. Learn how to build a v... » read more

Study On High-Performance Computing Usage For Engineering Simulation
By Ansys - 12 May, 2021 - Comments: 0

Simulation will play a critical role in the development of new market disrupting technology, from autonomous vehicles to 5G cellular networks, and the need for on-premises or cloud-based HPC resources to support those efforts is only going to increase. This white paper explores: How companies are using HPC-based simulation. The effect of the COVID-19 pandemic on HPC usage and adoptio... » read more

6 Steps To Successful Board Level Reliability Testing
By Ansys - 07 Apr, 2021 - Comments: 0

For semiconductor manufacturers entering the automotive environment, the lack of universal qualifications standards often leads to inconsistent reliability expectations. The most efficient solution is to establish a robust and thorough BLR testing plan that is uniquely designed for a specific manufacturer validated by a broad range of industry experiences. 6 Steps to Successful Board Level R... » read more

Analysis And Development of Safety-Critical Embedded Systems
By Ansys - 13 Feb, 2021 - Comments: 0

Today’s automobiles and airplanes feature more electronic components than ever. Hundreds of connected systems enable safety-critical functions like braking, acceleration, steering, navigation and communication. Ansys has the only comprehensive simulation solution for designing safe, reliable systems — including hardware, electronics and embedded software — for human-controlled and autonom... » read more

Realize A More Productive EDA Environment From HPE With AMD
By Ansys - 13 Jan, 2021 - Comments: 0

Few industries are more competitive than modern electronics manufacturing and chip design. Consumers expect devices to be faster, cheaper, and more reliable with each generation. Whether large or small, electronics manufacturers rely on electronic design automation (EDA) to enable these improvements. Click here to access the white paper. » read more

HPC Appliance Boosts Simulation Performance
By Ansys - 09 Dec, 2020 - Comments: 0

High-performance computing (HPC) resources can provide a substantial boost to simulation, but an HPC cluster can be complex and difficult to manage. By deploying a managed HPC cluster for ARA, the client was able to eliminate internal maintenance and support overhead, while improving productivity and reliability for their Ansys workloads. Click here to read more. » read more

Chip-Package Co-Analysis Using Ansys RedHawk-CPA
By Ansys - 11 Nov, 2020 - Comments: 0

Ansys RedHawk-CPA is an integrated chip–package co-analysis solution that enables quick and accurate modeling of the package layout for inclusion in on-chip power integrity simulations using Ansys RedHawk. With RedHawk-CPA a designer can perform static IR drop analysis and AC hotspot analysis of the package layout following RedHawk static and dynamic analyses respectively. To ensure a reliab... » read more

Maximizing Ansys LS-DYNA Performance With AMD EPYC 7Fx2 Processors
By Ansys - 14 Oct, 2020 - Comments: 0

AMD EPYC 7Fx2 processors bring high frequencies and very highs ratios of cache per core to the 2nd Gen EPYC family of processors. EPYC 7Fx2 processors build on the large memory capacity, extreme memory bandwidth and massive I/O of the 2nd Gen EPYC family to deliver exceptional HPC workload performance. This paper describes the excellent performance of these chips in running Ansys LS-DYNA comput... » read more

Electro-Thermal Signoff For Next Gen 3DICs
By Ansys - 09 Sep, 2020 - Comments: 0

Multi-die designs, 2.5D and 3D, have been rising in popularity as they offer tremendously increased levels of integration, a smaller footprint, performance gains and more. While they are attractive for many applications, they also create design bottlenecks in the areas of thermal management and power delivery. For 3DICs, in addition to the complex SoC/PCB interactions seen in their 2D counterpa... » read more

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