Author's Latest Posts

Hot Or Not? An Introduction To Electrical Thermal Co-Design
By Cadence - 03 Feb, 2021 - Comments: 0

Heat transfer is not a one-way street. Traditionally, thermal analysis and management is thought of as a mechanical problem. However, modern electronic products are highly susceptible to electronic thermal issues. The electronics are often both the cause of thermal issues and the victim of overheating if temperature profiles exceed specifications. Indeed, over 50% of IC failures are related ... » read more

5G NR Design eMBB
By Cadence - 27 Jan, 2021 - Comments: 0

Next-generation 5G/6G communication systems will provide massive connectivity to the internet with extreme capacity, coverage, reliability, and ultra-low latency, enabling a wide range of new services made possible through innovative technologies. Enhanced mobile broadband (eMBB) extends the current mobile experience with high data throughput on the order of more than 10Gbps, high system capaci... » read more

Chiplets And Heterogeneous Packaging Are Changing System Design And Analysis
By Cadence - 21 Dec, 2020 - Comments: 0

In the domain of electronic product design, solely relying on process shrink as the primary driver of product innovation and improved system performance is no longer a viable approach. The cost and complexity associated with advanced nodes has everyone looking for alternatives to the traditional monolithic system on chip (SoC). The path most are taking leads to the world of “More than Moore�... » read more

How To Speed Up Large-Scale EM Simulation Of ICs Without Compromising Accuracy
By Cadence - 09 Dec, 2020 - Comments: 0

With growing on-chip radio frequency (RF) content, electromagnetic (EM) simulation of the passives is critical for a variety of reasons — from selecting the right RF design candidates to detecting parasitic coupling that directly impacts performance. Being on-chip, accurate EM analysis requires a tie into the process technology in the form of process design kits (PDKs) as well as a foundry-ce... » read more

System Simulation For RF Link Budget Analysis
By Cadence - 02 Dec, 2020 - Comments: 0

This white paper examines how a more rigorous link budget analysis of an entire system can be determined through simulation, and how performing link budget analysis enables designers to address losses, gains, and power levels to meet the operational requirements of the radio communications system. Click here to read more. » read more

Computational Software
By Cadence - 23 Nov, 2020 - Comments: 0

Electronics technology is evolving rapidly, becoming pervasive in our lives. There are more smart phones in use than there are people on earth, driver assistance is now common in automobiles, commercial airplanes have increasingly sophisticated infotainment, and wearable health monitors exist for a plethora of missions. Every device is generating and communicating massive amounts of data, inclu... » read more

Modified X-Band Push-Push Oscillator Simulation And Measurement
By Cadence - 11 Nov, 2020 - Comments: 0

This eBook that explores the push-push oscillator configuration via harmonic balance (HB) computer simulation and test measurement. The unique operation of the push-push oscillator configuration is explored using HB simulation of spectral content and time-domain voltage waveforms. Dynamic load lines are investigated and utilized to explore peak signal excursion and degree of nonlinearity. Predi... » read more

Rigid-Flex PCB Bending EM Analysis Using Clarity 3D Solver
By Cadence - 28 Oct, 2020 - Comments: 0

Rigid-Flex PCBs have been used in many modern electronic devices (such as mobile phones, laptops, and wearables, among others), due to their form factor, light weight, and cost-effectiveness. Electromagnetic (EM) analysis of Rigid-Flex PCBs has always been a challenging task for many commercially available 3D numerical solver technologies (FEM and FDTD), due to the complexity in the 3D designs.... » read more

3D PCB Design And Analysis: ECAD/MCAD And Where They Converge
By Cadence - 07 Oct, 2020 - Comments: 0

The design of a board and its ‘home’ are heavily interdependent. They require careful consideration to ensure everything will be in working order when your product is ultimately brought to market. Many designs have been derailed by conflicts between ECAD and MCAD. Something as simple as an improperly placed / communicated mounting hole can send your project into a tailspin of re-designs. ... » read more

5G NR Primer For Amplifier And Filter Design
By Cadence - 23 Sep, 2020 - Comments: 0

This primer examines some of the challenges engineers face when designing filters and power amplifiers for 5G New Radio (NR) communication systems. See how the Cadence AWR Design Environment platform can be used to simulate amplifier and filter performance under 5G operating conditions. Click here to continue reading.     » read more

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