Author's Latest Posts

mmWave Chip, Package, And Board Beamforming Solutions
By Cadence - 31 Mar, 2021 - Comments: 0

RF front-end architectures grow more complex with each generation of communication systems. To accommodate these architectures, more densification and miniaturization is taking place with electronic systems implemented through innovations in system-in-package (SiP) design. 5G data rates exceeding 1GB/s will be supported by the available bandwidth in the millimeter-wave (mmWave) spectrum and ... » read more

Overcoming Next-Generation AESA Radar Design Challenges
By Cadence - 24 Mar, 2021 - Comments: 0

Phased array antennas were first used in military radar systems to scan the radar beam quickly across the sky to detect planes and missiles. These systems are becoming popular for a variety of applications and new active electronically scanned arrays (AESAs) are being used for radar systems in satellites and unmanned aerial vehicles. As these systems are deployed in new and novel ways, size and... » read more

Multiband Active Antenna Tuner For Cellular IoT Applications
By Cadence - 10 Mar, 2021 - Comments: 0

This white paper discusses related design challenges and solutions for developing a multiband active antenna tuner for cellular internet of things (IoT) massive machine-type communications (mMTC) applications. Click here to read more. » read more

5G NR Design For eMBB
By Cadence - 24 Feb, 2021 - Comments: 0

This white paper examines the design challenges for eMBB products and provides examples of how these challenges can be overcome using the co-design capabilities in Cadence AWR Design Environment software. Click here to download with registration. » read more

Optimizing Power Supply
By Cadence - 10 Feb, 2021 - Comments: 0

Any electrical engineer knows providing power to your board is a key feature in PCB design. While most boards can be functional, their true quality shines when the perfect level of power to components is achieved. Building and designing better power supplies is the best way to ensure the end-product has full life-cycle potential. But how do we ensure we can convert a (potentially variable) i... » read more

Hot Or Not? An Introduction To Electrical Thermal Co-Design
By Cadence - 03 Feb, 2021 - Comments: 0

Heat transfer is not a one-way street. Traditionally, thermal analysis and management is thought of as a mechanical problem. However, modern electronic products are highly susceptible to electronic thermal issues. The electronics are often both the cause of thermal issues and the victim of overheating if temperature profiles exceed specifications. Indeed, over 50% of IC failures are related ... » read more

5G NR Design eMBB
By Cadence - 27 Jan, 2021 - Comments: 0

Next-generation 5G/6G communication systems will provide massive connectivity to the internet with extreme capacity, coverage, reliability, and ultra-low latency, enabling a wide range of new services made possible through innovative technologies. Enhanced mobile broadband (eMBB) extends the current mobile experience with high data throughput on the order of more than 10Gbps, high system capaci... » read more

Chiplets And Heterogeneous Packaging Are Changing System Design And Analysis
By Cadence - 21 Dec, 2020 - Comments: 0

In the domain of electronic product design, solely relying on process shrink as the primary driver of product innovation and improved system performance is no longer a viable approach. The cost and complexity associated with advanced nodes has everyone looking for alternatives to the traditional monolithic system on chip (SoC). The path most are taking leads to the world of “More than Moore�... » read more

How To Speed Up Large-Scale EM Simulation Of ICs Without Compromising Accuracy
By Cadence - 09 Dec, 2020 - Comments: 0

With growing on-chip radio frequency (RF) content, electromagnetic (EM) simulation of the passives is critical for a variety of reasons — from selecting the right RF design candidates to detecting parasitic coupling that directly impacts performance. Being on-chip, accurate EM analysis requires a tie into the process technology in the form of process design kits (PDKs) as well as a foundry-ce... » read more

System Simulation For RF Link Budget Analysis
By Cadence - 02 Dec, 2020 - Comments: 0

This white paper examines how a more rigorous link budget analysis of an entire system can be determined through simulation, and how performing link budget analysis enables designers to address losses, gains, and power levels to meet the operational requirements of the radio communications system. Click here to read more. » read more

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